Patents by Inventor Teruki Hyougatani

Teruki Hyougatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and resin for sealing a semiconductor device
    Patent number: 5539218
    Abstract: There is disclosed a semiconductor device wherein electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, whereby its size and cost are reduced.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: July 23, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shinobu Takahama, Akinobu Tamaki, Satoshi Hirakawa, Hitoshi Yamano, Teruki Hyougatani
  • Semiconductor device, resin for sealing same and method of fabricating same
    Patent number: 5430330
    Abstract: A semiconductor device where electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, its size and cost are therefore reduced.
    Type: Grant
    Filed: June 18, 1993
    Date of Patent: July 4, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shinobu Takahama, Akinobu Tamaki, Satoshi Hirakawa, Hitoshi Yamano, Teruki Hyougatani