Patents by Inventor Terumasa Ninomaru

Terumasa Ninomaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7786389
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: August 31, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki
  • Patent number: 7453702
    Abstract: A printed wiring board comprises the insulating layer 11 (12); at least one resistance element 311 (312) comprising a metal as a main component has 0.5 to 5 ?m of a roughened surface in an arithmetic means height in the one surface, in ?Z direction, and 5% to 50% of the arithmetic mean height in average thickness, which is embedded close to a surface on one side of the insulating layer 11 and a conductive pattern wired surface is composed of the one surface of the resistance element and the one side of the insulating layer 11; and the conductive pattern 351 (352), arranged on the conductive pattern wired surface, is connected to the terminal of the resistance element 311 (312). With this structure, it is provided the printed wiring board comprising the resistance element having an accurate and stable resistance value in a broader resistance value range.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: November 18, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Toshimasa Iwata, Terumasa Ninomaru, Takamichi Sugiura
  • Publication number: 20080115963
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 22, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Kiyotaka TSUKADA, Terumasa NINOMARU, Masaki KIZAKI
  • Patent number: 7312401
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: December 25, 2007
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki
  • Publication number: 20060068613
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 30, 2006
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki
  • Publication number: 20060049509
    Abstract: A printed wiring board comprises the insulating layer 11 (12); at least one resistance element 31, (312) comprising a metal as a main component has 0.5 to 5 ?m of a roughened surface in an arithmetic means height in the one surface, in ?Z direction, and 5% to 50% of the arithmetic mean height in average thickness, which is embedded close to a surface on one side of the insulating layer 11 and a conductive pattern wired surface is composed of the one surface of the resistance element and the one side of the insulating layer 11; and the conductive pattern 351 (352), arranged on the conductive pattern wired surface, is connected to the terminal of the resistance element 311 (312). With this structure, it is provided the printed wiring board comprising the resistance element having an accurate and stable resistance value in a broader resistance value range.
    Type: Application
    Filed: October 20, 2005
    Publication date: March 9, 2006
    Applicant: IBIDEN, CO., LTD.
    Inventors: Kiyotaka Tsukada, Toshimasa Iwata, Terumasa Ninomaru, Takamichi Sugiura