Abstract: A treating agent for liquid crystal alignment useful for formation of a liquid crystal alignment film obtained by coating a film on a substrate equipped with transparent electrodes, baking the film, and subjecting the film surface to a rubbing treatment, wherein the treating agent for liquid crystal alignment contains a polyimide precursor containing a repeating unit of the formula (I) and a solvent-soluble polyimide resin containing a repeating unit of the formula (II), and at least 1 mol % of R.sub.4 of the solvent-soluble polyimide resin of the formula (II) being a bivalent organic group constituting a diamine which has a long-chain alkyl group or fluorine-containing alkyl group with a carbon number of at least 6, and the solvent-soluble polyimide resin of the formula (II) being from 1 to 80% by weight based on the total polymer weight: ##STR1## (wherein each of R.sub.1 and R.sub.2 is a tetravalent organic group which constitutes tetracarboxylic acid or its derivative, each of R.sub.2 and R.sub.

Abstract: A polyimide varnish which is a solution having a polyimide and/or a polyimide precursor dissolved in an organic solvent and which is useful for forming a polyimide coating film on a substrate by coating the solution on the substrate followed by heat treatment, wherein from 5 wt % to 60 wt % of the organic solvent is a polypropylene glycol derivative of the formula (I): ##STR1## wherein n is 1 or 2, and R is hydrogen, a C.sub.1-4 alkyl group, a C.sub.1-4 alkenyl group or a C.sub.1-4 alkanoyl group.

Abstract: A treating agent for liquid crystal alignment useful for formation of a liquid crystal alignment film obtained by coating a film on a substrate equipped with transparent electrodes, baking the film, and subjecting the film surface to a rubbing treatment, wherein the treating agent for liquid crystal alignment contains a polyimide precursor containing a repeating unit of the formula (I) and a solvent-soluble polyimide resin containing a repeating unit of the formula (II), and at least 1 mol % of R.sub.4 of the solvent-soluble polyimide resin of the formula (II) being a bivalent organic group constituting a diamine which has a long-chain alkyl group or fluorine-containing alkyl group with a carbon number of at least 6, and the solvent-soluble polyimide resin of the formula (II) being from 1 to 80% by weight based on the total polymer weight: ##STR1## (wherein each of R.sub.1 and R.sub.2 is a tetravalent organic group which constitutes tetracarboxylic acid or its derivative, each of R.sub.2 and R.sub.

Abstract: A process for producing polyethylene comprises polymerizing ethylene or copolymerizing ethylene with other .alpha.-olefin in the presence of a catalyst system obtained by bringing the following components (I) to (III) in contact with one another:(I) a reaction product (B) obtained by reacting an intermediate reaction product (A) obtained by a reaction of a hydropolysiloxane with a Grignard reagent, with at least one nucleophilic reagent selected from an aldehyde, a ketone and an alcohol,(II) a transition metal compound, and(III) at least one organic aluminum compound.

Abstract: An electrically conductive composition comprising 100 parts by weight of a copper powder, from 2 to 100 parts by weight of a resin binder, and from 0.1 to 30 parts by weight of an additive agent, wherein the additive agent is at least one compound selected from the group consisting of .alpha.-ketols, aliphatic and aromatic thiols, thiodiarylamines, tall oils, rosins, rosin esters, higher fatty acid amides, o-aminophenols, 2,2'-dipyridyls, and 2,2'-diquinolyls.

Abstract: Polymerization of ethylene or copolymerization of ethylene with other .alpha.-olefin is carried out in the presence of a specific catalyst system. The catalyst system is obtained by preparing a reaction product (A) of an organic aluminum compound (I) represented by the formula AlR.sub.n.sup.1 X.sub.3-n where R.sup.