Abstract: A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.

Abstract: A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.

Abstract: A second metal mask (13) having a screen part (13A) provided with a plurality of parallel, fine slits (13a) arranged at very small intervals is placed on a base plate (12) serving also as a first metal mask and provided with a plurality of windows (18) defining regions in which a material is to be deposited. One end of the second metal mask (13) is fastened to the base plate (12) by a mask clamp (20) and the other end of the same is fastened to a slider (23). Resilient force is applied to the slider (23) by compression coil springs (30). Thus, the screen part (13A) of the second metal mask (13) is tensioned and thereby the slits (13a) are stretched straight and are extended at predetermined pitches. A substrate (17) placed on the second mask (13) is subjected to a vacuum evaporation process to form fine patterns on the substrate (17) in a gang-patterning mode.