Abstract: A substrate processing apparatus comprising: a substrate process chamber having a plasma generation space where a processing gas is plasma-excited and a substrate processing space communicating with the plasma generation space; a substrate mounting table installed inside the substrate processing space and for mounting a substrate; an inductive coupling structure provided with a coil installed to be wound around an outer periphery of the plasma generation space; a substrate support table elevating part for raising and lowering the substrate mounting table; a gas supply part for supplying the processing gas to the plasma generation space; and a controller for controlling the substrate support table elevating part, based on a power value of a high-frequency power supplied to the coil, so that the substrate mounted on the substrate mounting table is positioned at a target height according to the power value and spaced apart from a lower end of the coil.

Abstract: Disclosed is a method for welding wear-resisting hard metals directly to iron base members which are slide or wear members of machinery. Hard metals comprising a tungsten carbide and a binder consisting of 15 to 30% by weight of Ni and/or Co is employed as said hard metals. A Ni alloy metal containing no Cr is used as a filler metal.