Abstract: An integrated circuit device includes a barrier layer as an underlying layer for a wiring conductor layer. The barrier layer is formed of titanium oxide-titanium nitride or titanium nitride or composite layers of titanium, 2-titanium nitride and titanium nitride. The barrier layer may contain oxygen or carbon. A method of manufacturing an integrated circuit device includes steps of introducing a gas to the vicinity of a substrate disposed within a vacuum chamber, and forming a titanium oxide-titanium nitride thin film or titanium nitride film or the composite film by depositing titanium in vapor phase by using a cluster-type ion source while irradiating the substrate with nitrogen ions. A thin film forming apparatus comprises a cluster type ion source and a gas ion source.

Abstract: A substrate cleaning device comprises a gas jet nozzle for jetting gas toward a substrate, an electron beam irradiation selection for irradiating electron beams into the jetted gas to induce glow discharge, and an ion acceleration section for drawing ions out of the glow discharge to impart the ions with energy, causing the ions to uniformly bombard onto the substrate.

Abstract: A thin film forming device comprises a vacuum tank held at the predetermined degree of vaccum; a substrate placed in the vacuum tank; internal tanks disposed in the vacuum tank and each having an opening opposite to the substrate; gas jet nozzles, one arranged in each of the internal tanks and connected with reactive gas sources outside the vacuum tank, for jetting reactive gases of different types toward the substrate through the openings of the internal tanks; and electron beam irradiation devices disposed close to a passage, through which the reactive gases jetted from the gas jet nozzles pass, for irradiating electron beams to the reactive gases.

Abstract: A cooling apparatus for machinery utilizing a vaporizable liquid refrigerant and constituted by a tank in which machinery to be cooled is immersed in the vaporizable liquid refrigerant sealed within the tank, a condensor disposed above the tank substantially horizontally, and distributing pipes connecting the tank with the condensor so as to convey the vapor produced from the vaporizable liquid refrigerant within the tank by the heat generated in the machinery to the condenser, and the vapor is condensed in the condenser, returning to the tank again through passages separately constituted in the distributing pipes.

Abstract: A method of manufacturing a molded coil for use in an electric apparatus such as a molded transformer or a reactor. The method includes the steps of covering a winding with an insulating prepreg, curing the prepreg under heat, and casting a synthetic resin around the prepreg. The method makes it possible to minimize any thermal stress that may develop in the molded resin layer.

Abstract: An electrostatic shield for an electrical transformer comprises a substantially ring-shaped inner insulator of asymmetric vertical cross-section with a side confronting a coil of the transformer being substantially planar and the remaining surface being of a curved section, a field concentration relaxation conductor formed from a conductive foil, completely surrounding the inner insulator, and a multiple outer insulator comprising at least one layer of polyethylene terephthalate (PET) film and at least one mica insulation layer with mica bonded to a non-conductive backing film such as glass tape or PET film by a bonding agent such as epoxy resin, whereby the dielectric strength of the electrostatic shield and hence the transformer, is substantially improved.