Patents by Inventor Teruo Iwasaki

Teruo Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5209813
    Abstract: A lithographic method and a lithographic apparatus ar disclosed in which the height of a silicon wafer making up an object of lithography is accurately measured. A lithographic apparatus such as an electron beam apparatus having a height-measuring instrument built therein is effectively used for forming a pattern on the order of submicrons.
    Type: Grant
    Filed: October 24, 1991
    Date of Patent: May 11, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Yoshitada Oshida, Genya Matsuoka, Teruo Iwasaki, Toshio Kaneko, Hiroyuki Takahashi, Hiroyoshi Ando, Hidenori Yamaguchi, Katsuhiro Kawasaki
  • Patent number: 5166529
    Abstract: An electron beam lithography apparatus, comprising an electron beam source for irradiating an electron beam on a specimen surface, a deflectional controller of the electron beam, a focal controller of the electron beam on the specimen surface, a light source which irradiates two monochromatic lights on the surface having wavelengths which are different a half thereof each other, a signal processor for obtaining correction values in a height direction of the beam based on the reflected lights from the surface, and a means for adjusting the focal controller according to the correction values in the height direction. As the wavelengths of the two monochromatic lights on the surface are different in a half wavelength each other, an interference caused by a photo-resist on the specimen is prevented.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: November 24, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyoshi Ando, Genya Matsuoka, Hiroyuki Takahashi, Hidenori Yamaguchi, Teruo Iwasaki
  • Patent number: 4445040
    Abstract: A shaping aperture used in a charged particle forming system and provided with a slit for shaping the cross section of a charged beam emitted is disclosed in which at least two thin plates each provided with a through-hole for passing the charged particle beam therethrough are piled so as to form a shaping slit of a desired form by the through-holes.
    Type: Grant
    Filed: July 18, 1983
    Date of Patent: April 24, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Teruo Iwasaki, Norio Saitou, Akira Yanagisawa