Abstract: An optical device includes an electro-optic crystal layer, a first optical waveguide formed in the electro-optic crystal layer, and an electrode that applies an electric signal to the first optical waveguide. Further, the optical device includes a second optical waveguide in an amorphous state formed in the electro-optic crystal layer and connected to the first optical waveguide.

Abstract: An optical waveguide device includes a substrate on which an intermediate layer, a thin-film LN layer of lithium niobate, and a buffer layer are stacked; an optical waveguide formed in the thin-film LN layer; and a plurality of electrodes near the optical waveguide. The intermediate layer and the buffer layer contain a same material of a metal element of any one of group 3 of group 18 of a periodic table of elements.

Abstract: An optical device includes a substrate, a first cladding layer that is laminated on one surface of the substrate, and a first optical waveguide that is formed in the first cladding layer at a side opposite to the substrate in the first cladding layer. The optical device further includes an electro-optic crystal layer that is laminated on a surface of the first cladding layer at a side opposite to the substrate, and a second optical waveguide that is formed of the electro-optic crystal layer on a surface of the electro-optic crystal layer at a side opposite to the first cladding layer. The optical device further includes a second cladding layer that is laminated on a surface of the electro-optic crystal layer at a side opposite to the first cladding layer.

Abstract: An optical device includes an electro-optic crystal layer, a first optical waveguide formed in the electro-optic crystal layer, and an electrode that applies an electric signal to the first optical waveguide. Further, the optical device includes a second optical waveguide in an amorphous state formed in the electro-optic crystal layer and connected to the first optical waveguide.

Abstract: An optical waveguide device includes an intermediate layer, a thin-film LN layer including X-cut lithium niobate, and a buffer layer stacked on a substrate; an optical waveguide formed in the thin-film LN layer; and an electrode for driving. The intermediate layer is formed by an upper first intermediate layer and a lower second intermediate layer, the second intermediate layer having a permittivity that is smaller than a permittivity of the first intermediate layer.

Abstract: An optical device includes a thin film Lithium Niobate (LN) layer, a first optical waveguide, and a second optical waveguide. The thin film LN layer is an X-cut or a Y-cut LN layer. The first optical waveguide is an optical waveguide that is formed on the thin film LN layer along a direction that is substantially perpendicular to a Z direction of a crystal axis of the thin film LN layer. The second optical waveguide is an optical waveguide that is routed and connected to the first optical waveguide. At least a part of a core of the first optical waveguide is made thicker than a core of the second optical waveguide.

Abstract: An optical waveguide device includes an intermediate layer, a thin-film LN layer including X-cut lithium niobate, and a buffer layer stacked on a substrate; an optical waveguide formed in the thin-film LN layer; and an electrode for driving. The intermediate layer is formed by an upper first intermediate layer and a lower second intermediate layer, the second intermediate layer having a permittivity that is smaller than a permittivity of the first intermediate layer.

Abstract: An optical waveguide device includes a substrate on which an intermediate layer, a thin-film LN layer of lithium niobate, and a buffer layer are stacked; an optical waveguide formed in the thin-film LN layer; and a plurality of electrodes near the optical waveguide. The intermediate layer and the buffer layer contain a same material of a metal element of any one of group 3 of group 18 of a periodic table of elements.

Abstract: An optical device includes lower cladding layer formed of an amorphous insulator on a substrate; a first cladding region, an active region, and a second cladding region formed on the lower cladding layer, one of the first cladding region and the second cladding region being formed on a monocrystal; an upper cladding layer formed of an insulator on the active region; a first electrode connected with the first cladding region; and a second electrode connected with the second cladding region.

Abstract: A method for manufacturing a P-type MOS transistor includes forming a gate insulating film on the substrate, forming a gate electrode from amorphous silicon containing no impurities on the gate insulating film, performing a heat treatment for controlling the film characteristics of the amorphous silicon, depositing a nickel (Ni) layer on the gate electrode, and forming nickel silicides from the gate electrode and the nickel (Ni).

Abstract: A method for fabricating an electron device on a substrate includes the steps of forming a dummy film over the substrate such that the dummy film covers a device region of the substrate and an outer region of the substrate outside the device region, forming a dummy pattern by patterning the dummy film such that the dummy pattern has a first height in the device region and a second height smaller than the first height in the outer region, forming another film over the substrate such that the film covers the dummy pattern in the device region and in the outer region with a shape conformal to a cross-sectional shape of the dummy pattern, and applying an anisotropic etching process acting generally perpendicularly to the substrate such that a surface of the substrate is exposed in the device region and in the outer region.

Abstract: A semiconductor device fabrication method by which CMOS transistors with low-resistance metal gate electrodes each having a proper work function can be fabricated. A HfN layer in which nitrogen concentration in an nMOS transistor formation region differs from nitrogen concentration in a pMOS transistor formation region is formed. A MoN layer is formed over the HfN layer and heat treatment is performed. Nitrogen diffuses from the MoN layer into the HfN layer in which nitrogen concentration is low and a work function is set by the HfN layer according to nitrogen concentration which depends on the nitrogen content of the HfN layer before the heat treatment and the amount of nitrogen that diffuses into the HfN layer. On the other hand, nitrogen hardly diffuses from the MoN layer into the HfN layer which originally has a certain nitrogen content, and a work function is set by the HfN layer according to nitrogen concentration in the HfN layer before the heat treatment.

Abstract: A method for manufacturing a P-type MOS transistor includes forming a gate insulating film on the substrate, forming a gate electrode from amorphous silicon containing no impurities on the gate insulating film, performing a heat treatment for controlling the film characteristics of the amorphous silicon, depositing a nickel (Ni) layer on the gate electrode, and forming nickel silicides from the gate electrode and the nickel (Ni).

Abstract: An MIM device includes a lower electrode of a metal nitride film, a hysteresis film of an oxide film containing Nb formed on the lower electrode, and an upper electrode of a metal nitride film formed on the hysteresis film.

Abstract: A semiconductor device fabrication method by which CMOS transistors with low-resistance metal gate electrodes each having a proper work function can be fabricated. A HfN layer in which nitrogen concentration in an nMOS transistor formation region differs from nitrogen concentration in a pMOS transistor formation region is formed. A MoN layer is formed over the HfN layer and heat treatment is performed. Nitrogen diffuses from the MoN layer into the HfN layer in which nitrogen concentration is low and a work function is set by the HfN layer according to nitrogen concentration which depends on the nitrogen content of the HfN layer before the heat treatment and the amount of nitrogen that diffuses into the HfN layer. On the other hand, nitrogen hardly diffuses from the MoN layer into the HfN layer which originally has a certain nitrogen content, and a work function is set by the HfN layer according to nitrogen concentration in the HfN layer before the heat treatment.

Abstract: An MIM device includes a lower electrode of a metal nitride film, a hysteresis film of an oxide film containing Nb formed on the lower electrode, and an upper electrode of a metal nitride film formed on the hysteresis film.

Abstract: A method for fabricating an electron device on a substrate includes the steps of forming a dummy film over the substrate such that the dummy film covers a device region of the substrate and an outer region of the substrate outside the device region, forming a dummy pattern by patterning the dummy film such that the dummy patter has a first height in the device region and a second height smaller than the first height in the outer region, forming another film over the substrate such that the film covers the dummy pattern in the device region and in the outer region with a shape conformal to a cross-sectional shape of the dummy pattern, and applying an anisotropic etching process acting generally perpendicularly to the substrate such that a surface of the substrate is exposed in the device region and in the outer region.

Abstract: A high-performance CMOS field effect semiconductor device using metal gate electrodes. An n-type gate electrode and a p-type gate electrode are formed by using a same metal and differ in nitrogen concentration. As a result, a high-performance CMOS field effect semiconductor device having the n-type gate electrode and the p-type gate electrode between which a work function difference is a predetermined value can be realized. By forming a low-resistance layer on layers which are formed by using the same metal and which differ in nitrogen concentration, it is possible to reduce the resistance of the n-type gate electrode and the p-type gate electrode while controlling the work functions of the n-type gate electrode and the p-type gate electrode. Therefore, a higher-performance CMOS field effect semiconductor device can be realized.

Abstract: This invention aims at providing an optical waveguide device capable of stably operating for an extended period of time. The optical waveguide device comprises an optical waveguide path formed inside a surface of an electro-optical substrate, a buffer layer formed on the optical waveguide path, and a driving electrode for impressing an electric field so as to change a refractive index of the optical waveguide path, wherein the buffer layer is made of a transparent dielectric or insulator of a mixture between silicon dioxide and an oxide of at least one element selected from the group consisting of the metal elements of the Groups III to VIII, Ib and IIb of the Periodic Table and semiconductor elements other than silicon, or a transparent dielectric or insulator of an oxide between silicon and at least one of the metal elements and semiconductor elements described above.

Abstract: This invention aims at providing an optical waveguide device capable of stably operating for an extended period of time. The optical waveguide device comprises an optical waveguide path formed inside a surface of an electro-optical substrate, a buffer layer formed on the optical waveguide path, and a driving electrode for impressing an electric field so as to change a refractive index of the optical waveguide path, wherein the buffer layer is made of a transparent dielectric or insulator of a mixture between silicon dioxide and an oxide of at least one element selected from the group consisting of the metal elements of the Groups III to VIII, Ib and IIb of the Periodic Table and semiconductor elements other than silicon, or a transparent dielectric or insulator of an oxide between silicon and at least one of the metal elements and semiconductor elements described above.