Patents by Inventor Teruo Oda

Teruo Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929343
    Abstract: There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieve a favorable bond reliability of the 2nd bonding part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, an average value X is 0.2 or more and 35.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 12, 2024
    Assignee: NIPPON MICROMETAL CORPORATION
    Inventors: Daizo Oda, Motoki Eto, Takashi Yamada, Teruo Haibara, Ryo Oishi
  • Patent number: 9671436
    Abstract: An electric current sensor includes a core having a coupling portion formed by bending a part of a plate member, and one end portion and the other end portion of the plate member are disposed to oppose to each other through a constant magnetic gap on a side opposite from the coupling portion. The core has: a first tapered portion in which a width of the plate member continuously decreases from one end of the coupling portion adjacent to the one end portion to a distal end of the one end portion; and a second tapered portion in which the width of the plate member continuously decreases from an other end of the coupling portion adjacent to the other end portion to a distal end of the other end portion.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: June 6, 2017
    Assignee: DENSO CORPORATION
    Inventors: Takeshi Tsukamoto, Tatsuya Takagi, Teruo Oda
  • Publication number: 20150377932
    Abstract: An electric current sensor includes a core having a coupling portion formed by bending a part of a plate member, and one end portion and the other end portion of the plate member are disposed to oppose to each other through a constant magnetic gap on a side opposite from the coupling portion. The core has: a first tapered portion in which a width of the plate member continuously decreases from one end of the coupling portion adjacent to the one end portion to a distal end of the one end portion; and a second tapered portion in which the width of the plate member continuously decreases from an other end of the coupling portion adjacent to the other end portion to a distal end of the other end portion.
    Type: Application
    Filed: March 10, 2014
    Publication date: December 31, 2015
    Inventors: Takeshi TSUKAMOTO, Tatsuya TAKAGI, Teruo ODA
  • Patent number: 8578761
    Abstract: A concentration sensor device includes a sensor unit, a substrate, and a sedimentation limit unit. The sensor unit detects a concentration of a specific component contained in liquid. The substrate has a face to which the sensor unit is arranged. The sedimentation limit unit is integrally arranged with the sensor unit or arranged at an upstream side of the sensor unit in a flowing direction of the liquid. The sedimentation limit unit is configured to prevent sedimentation of a foreign object on the sensor unit. The sedimentation limit unit includes a piezoelectric element to vibrate when electricity is supplied so as to promote the foreign object to be separated from the sensor unit. The substrate has a recess recessed in a thickness direction of the substrate.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: November 12, 2013
    Assignee: DENSO CORPORATION
    Inventors: Kenji Fukumura, Tetsuo Yoshioka, Tetsuo Fujii, Takaaki Kawai, Hirofumi Higuchi, Teruo Oda, Yasuyuki Okuda
  • Patent number: 8009518
    Abstract: An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: August 30, 2011
    Assignees: DENSO CORPORATION, Nippon Soken, Inc.
    Inventors: Yasuyuki Okuda, Kiyonari Kojima, Teruo Oda, Akitoshi Yamanaka
  • Publication number: 20100235107
    Abstract: A concentration sensor device includes a sensor unit, a substrate, and a sedimentation limit unit. The sensor unit detects a concentration of a specific component contained in liquid. The substrate has a face to which the sensor unit is arranged. The sedimentation limit unit is integrally arranged with the sensor unit or arranged at an upstream side of the sensor unit in a flowing direction of the liquid. The sedimentation limit unit is configured to prevent sedimentation of a foreign object on the sensor unit. The sedimentation limit unit includes a piezoelectric element to vibrate when electricity is supplied so as to promote the foreign object to be separated from the sensor unit. The substrate has a recess recessed in a thickness direction of the substrate.
    Type: Application
    Filed: March 25, 2009
    Publication date: September 16, 2010
    Applicant: Denso Corporation
    Inventors: Kenji Fukumura, Tetsuo Yoshioka, Tetsuo Fujii, Takaaki Kawai, Hirofumi Higuchi, Teruo Oda, Yasuyuki Okuda
  • Patent number: 7640798
    Abstract: A semiconductor device includes: a semiconductor substrate; a flow sensor having a first heater for detecting a flow rate of fluid; and a humidity sensor for detecting a humidity of the fluid. The flow sensor and the humidity sensor are disposed on the semiconductor substrate. The flow sensor is disposed around the humidity sensor. The humidity sensor is disposed on an upstream side of the first heater. Since the device includes the humidity sensor, moisture in the fluid is compensated so that detection accuracy of the flow rate is improved.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: January 5, 2010
    Assignee: DENSO CORPORATION
    Inventor: Teruo Oda
  • Publication number: 20090168603
    Abstract: An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.
    Type: Application
    Filed: December 23, 2008
    Publication date: July 2, 2009
    Applicants: DENSO CORPORATION, NIPPON SOKEN, INC.
    Inventors: Yasuyuki Okuda, Kiyonari Kojima, Teruo Oda, Akitoshi Yamanaka, Takaaki Kawai, Makiko Sugiura, Takayuki Ishikawa
  • Patent number: 7461551
    Abstract: A window fog detecting apparatus has an optical type fog detecting sensor for optically detecting fog occurring at a window glass, a humidity sensor for detecting a relative humidity of air at an interior side of the window glass, and a sensor output correcting unit. When a fog occurrence at the window glass is determined based on the output values of the optical type fog detecting sensor, the sensor output correcting unit corrects the relative humidity detected by the humidity sensor based on output values of the optical type fog detecting sensor.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: December 9, 2008
    Assignee: Denso Corporation
    Inventors: Takuya Kataoka, Teruo Oda
  • Publication number: 20080148842
    Abstract: A semiconductor device includes: a semiconductor substrate; a flow sensor having a first heater for detecting a flow rate of fluid; and a humidity sensor for detecting a humidity of the fluid. The flow sensor and the humidity sensor are disposed on the semiconductor substrate. The flow sensor is disposed around the humidity sensor. The humidity sensor is disposed on an upstream side of the first heater. Since the device includes the humidity sensor, moisture in the fluid is compensated so that detection accuracy of the flow rate is improved.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 26, 2008
    Applicant: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7312406
    Abstract: A sensor includes a metallic housing having a hollow portion, a metallic terminal pin, a part of which is inserted into the hollow portion of the housing, a sensing element connected to the terminal pin, and a resin casing. The terminal pin and the resin casing provide a connector for connecting an outer circuit outside the sensor. A part of the resin casing is disposed in the hollow portion. The terminal pin and the housing are molded with the resin casing by insert molding so that the resin casing, the terminal pin, and the housing are integrated together.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: December 25, 2007
    Assignee: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7302855
    Abstract: A pressure detection device includes a sensing part that outputs an electrical signal responsive to an applied pressure, a pressure receiving diaphragm that receives a pressure from a subject device, a cylindrical stem having a first end connected to the sensing part and a second end connected to the pressure receiving diaphragm, and a pressure transmission member located within the cylindrical member to transmit the pressure received by the pressure receiving diaphragm to the sensing part. In the pressure detection device, a side wall portion of the cylindrical stem has a spring portion which is provided to generate an elastic force in an axial direction of the cylindrical member. Accordingly, fluctuations in a spring characteristic acting on a pressure transmission mechanism of the pressure detection device can be effectively restricted by the spring portion.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: December 4, 2007
    Assignee: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7263891
    Abstract: Pressure detecting apparatus includes: a housing; a pipe extending from one end of the housing and having an elongated shape; and a pressure sensitive element for detecting pressure and outputting a signal corresponding to the pressure. The pipe includes a top end capable of receiving the pressure. The pressure sensitive element is disposed on the top end of the pipe. The housing includes a connector for retrieving the signal from the pressure sensitive element. The pipe further includes a wiring member disposed inside the pipe so that the wiring member connects between the pressure sensitive element and connector electrically.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: September 4, 2007
    Assignee: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7225679
    Abstract: Two sides of a single metal plate are bent to form the structure of a spring terminal having two spring portions. In the spring terminal having such a structure, the two spring portions are different from each other in a natural frequency. For this reason, when external vibrations are applied to a pressure sensor, even if one of the two spring portions of the spring terminal resonates with the external vibrations, the other spring portion can keep the electric connection between a circuit in a substrate and a terminal.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: June 5, 2007
    Assignee: DENSO Corporation
    Inventors: Haruhiko Miyagawa, Teruo Oda
  • Patent number: 7191658
    Abstract: One end of a rod-like pressure-conveying member is disposed in a sensing unit, and the other end extends into and through an insertion hole of an engine. A combustion pressure, to which the other end of the rod-like member is exposed, is conveyed to the sensing unit through the pressure-conveying member for the detection of the combustion pressure. The pressure-conveying member resonates at a knocking frequency fn of the engine and the knocking frequency fn is detected based on the resonance of the pressure-conveying member.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: March 20, 2007
    Assignee: DENSO Corporation
    Inventors: Teruo Oda, Inao Toyoda
  • Patent number: 7114396
    Abstract: A pressure sensor has a sensing unit and a pressure transmitting rod housed in a case, and a pressure receiving diaphragm. The case has a sensing unit housing portion and a pipe portion that extends from the sensing unit housing portion in a form of a pipe. The pipe portion includes an inner pipe and an outer pipe. The inner pipe is arranged inside the outer pipe and fixed to the outer pipe. The pipe portion has the first end located adjacent to the sensing unit and the second end away from the sensing unit. The inner pipe is projected from the outer pipe at the second end of the pipe portion. The pressure receiving diaphragm is welded to the inner pipe at the second end of the pipe portion such that it covers an opening of the inner pipe. The pressure transmitting rod is arranged inside the case such that its first end and second end are located on the sensing unit side and the pressure receiving diaphragm side, respectively.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: October 3, 2006
    Assignee: Denso Corporation
    Inventors: Teruo Oda, Yasuo Shibata
  • Publication number: 20060207325
    Abstract: A window fog detecting apparatus has an optical type fog detecting sensor for optically detecting fog occurring at a window glass, a humidity sensor for detecting a relative humidity of air at an interior side of the window glass, and a sensor output correcting unit. When a fog occurrence at the window glass is determined based on the output values of the optical type fog detecting sensor, the sensor output correcting unit corrects the relative humidity detected by the humidity sensor based on output values of the optical type fog detecting sensor.
    Type: Application
    Filed: March 16, 2006
    Publication date: September 21, 2006
    Applicant: DENSO Corporation
    Inventors: Takuya Kataoka, Teruo Oda
  • Publication number: 20060090569
    Abstract: Two sides of a single metal plate are bent to form the structure of a spring terminal having two spring portions. In the spring terminal having such a structure, the two spring portions are different from each other in a natural frequency. For this reason, when external vibrations are applied to a pressure sensor, even if one of the two spring portions of the spring terminal resonates with the external vibrations, the other spring portion can keep the electric connection between a circuit in a substrate and a terminal.
    Type: Application
    Filed: December 22, 2005
    Publication date: May 4, 2006
    Applicant: DENSO CORPORATION
    Inventors: Haruhiko Myagawa, Teruo Oda
  • Publication number: 20060090566
    Abstract: A pressure detection device includes a sensing part that outputs an electrical signal responsive to an applied pressure, a pressure receiving diaphragm that receives a pressure from a subject device, a cylindrical stem having a first end connected to the sensing part and a second end connected to the pressure receiving diaphragm, and a pressure transmission member located within the cylindrical member to transmit the pressure received by the pressure receiving diaphragm to the sensing part. In the pressure detection device, a side wall portion of the cylindrical stem has a spring portion which is provided to generate an elastic force in an axial direction of the cylindrical member. Accordingly, fluctuations in a spring characteristic acting on a pressure transmission mechanism of the pressure detection device can be effectively restricted by the spring portion.
    Type: Application
    Filed: October 18, 2005
    Publication date: May 4, 2006
    Applicant: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7002227
    Abstract: A pressure detecting device includes a semiconductor substrate (30, 200, 300, 400) for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member (20) having electrically conductive properties disposed on the front surface of the semiconductor substrate (30, 200, 300, 400). The substrate (30, 200, 300, 400) and the pressure transmitting member (20) are accommodated in a housing (10). A lead member (50) electrically independent of the housing (10) is accommodated in the housing (10) at the back surface side of the semiconductor substrate (30, 200, 300, 400), and the lead member (50) and an electrode (35b) of the substrate (30, 200, 300, 400) are electrically connected to each other through conductive adhesive material (40). The housing (10) preferably includes a first portion (101), a second portion (102) having smaller thermal conductivity than the first portion, and an electrically conductive partition portion (103).
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: February 21, 2006
    Assignee: Denso Corporation
    Inventors: Inao Toyoda, Teruo Oda, Seiichirou Otake, Hiroaki Tanaka