Abstract: A semiconductor die includes at least one first semiconductor device located on a first substrate, a first pad-level dielectric layer which is a diffusion barrier overlying the at least one first semiconductor device, and first bonding structures including a respective first metallic bonding pad embedded in the first pad-level dielectric layer. Each of the first bonding structures includes a metallic fill material portion having a horizontal distal surface that is located within a horizontal plane including a horizontal distal surface of the first pad-level dielectric layer, and a metallic liner laterally surrounding the metallic fill material portion and vertically spaced from the horizontal plane by a vertical recess distance.

Abstract: A semiconductor die includes at least one first semiconductor device located on a first substrate, a first pad-level dielectric layer which is a diffusion barrier overlying the at least one first semiconductor device, and first bonding structures including a respective first metallic bonding pad embedded in the first pad-level dielectric layer. Each of the first bonding structures includes a metallic fill material portion having a horizontal distal surface that is located within a horizontal plane including a horizontal distal surface of the first pad-level dielectric layer, and a metallic liner laterally surrounding the metallic fill material portion and vertically spaced from the horizontal plane by a vertical recess distance.

Abstract: A method of forming a device structure includes forming a memory-level structure including a three-dimensional memory device over a front side surface of a semiconductor substrate, forming memory-side dielectric material layers over the memory-level structure, bonding a handle substrate to the memory-side dielectric material layers, thinning the semiconductor substrate while the handle substrate is attached to the memory-side dielectric material layers, forming a driver circuit including field effect transistors on a backside semiconductor surface of the semiconductor substrate after thinning the semiconductor substrate, and removing the handle substrate from the memory-side dielectric material layers.

Abstract: A memory die includes an alternating stack of insulating layers and electrically conductive layers, memory stack structures extending through the alternating stack, and each of the memory stack structures includes a respective vertical semiconductor channel and a respective memory film, drain regions located at a first end of a respective one of the vertical semiconductor channels, and a source layer having a first surface and a second surface. The first surface is located at a second end of each of the vertical semiconductor channels, and a semiconductor wafer is not located over the second surface of the source layer.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a carrier substrate. Memory stack structures vertically extend through the alternating stack. Each memory stack structure includes a respective vertical semiconductor channel and a respective memory film. A pass-through via structure vertically extends through a dielectric material portion that is adjacent to the alternating stack. The memory die can be bonded to a logic die containing peripheral circuitry for supporting operations of memory cells within the memory die. A distal end of each of the vertical semiconductor channels is physically exposed by removing the carrier substrate. A source layer is formed directly on the distal end each of the vertical semiconductor channels. A backside bonding pad or bonding wire is formed to be electrically connected to the pass-through via structure.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a carrier substrate. Memory stack structures vertically extend through the alternating stack. Each memory stack structure includes a respective vertical semiconductor channel and a respective memory film. A pass-through via structure vertically extends through a dielectric material portion that is adjacent to the alternating stack. The memory die can be bonded to a logic die containing peripheral circuitry for supporting operations of memory cells within the memory die. A distal end of each of the vertical semiconductor channels is physically exposed by removing the carrier substrate. A source layer is formed directly on the distal end each of the vertical semiconductor channels. A backside bonding pad or bonding wire is formed to be electrically connected to the pass-through via structure.