Abstract: An ink jet print head substrate capable of precisely blowing fuse element to store data reliably is provided. An ink jet print head incorporating such a substrate and an ink jet printing apparatus are also provided. The interlayer insulating film formed over the fuse element is made of a material that has a lower melting point than the material of the fuse element and which forms a cavity therein by heat produced when the fuse elements is blown.

Abstract: A recording head substrate allowing an increased number of the exothermic bodies driven at a time without increasing the substrate size so as to increase a number of nozzles arranged in high density. The recording head substrate includes a plurality of electrothermal conversion members having exothermic bodies respectively corresponding to a plurality of discharge ports; a plurality of drive elements for driving the exothermic bodies; common wiring A connected to the exothermic bodies; and common wiring B connected to the drive elements; and an electrode pad connected to the common wiring A and the common wiring B. A number of the exothermic bodies driven at a time is determined by (RlineA+RlineB)/(Rh+Rd)<0.05/(0.95 n?1).

Abstract: A semiconductor device includes a lateral end surface; and a connection electrode for external electrical connection, the connection electrode is exposed at the side surface.

Abstract: The present invention provides a substrate for ink jet including a heating resistor generating thermal energy for discharging an ink from an ink discharge port and an upper protective layer which is formed above the heating resistor and has a contacting surface with the ink. Furthermore, the upper protective layer is made of an amorphous alloy consisting of Ta and Cr in which the content of Ta is more than that of Cr. This constitution allows for the substrate excellent in cavitation resistance and corrosion resistance, and capable of high durability while having similar discharge performance to that of a conventional protective layer made of a Ta film. The present invention further provides an ink jet head comprising the above-mentioned substrate, and a manufacturing method thereof.

Abstract: In an ink jet head circuit board including a heater for generating thermal energy used for ejecting ink in response to application of electricity, a drop in thermal energy efficiency is prevented while reducing an area of the heater to achieve higher-resolution and higher-image-quality printing, and damages on the heater attributable to a manufacturing process are avoided. To achieve this, a resistor layer is disposed on an electrode wire layer; and two protective layers are disposed thereon. Then the upper protective layer is removed in a site above the heater. Accordingly, it is possible to dispose the protective layers without causing a decrease in an effective bubble generating region, and to improve thermal energy efficiency by reducing the effective thickness of the protective layer above the heater. Moreover, the resistor layer is covered with the first protective layer and is thereby prevented from adverse effects in the manufacturing process such as etching processes.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: For improving adhesion between a protective layer having a portion coming into contact with ink in a substrate for an ink jet head, and a resin layer thereby ensuring reliability in quality over a prolonged period, the invention provides a substrate for an ink jet head including a heat-generating resistor constituting a heat generating portion, an electrode wiring electrically connected with the heat-generating resistor and an upper protective layer provided on the heat-generating resistor and the electrode wiring across an insulating protective layer, wherein after forming an upper protective layer in which a Ta layer is laminated on a layer formed by a TaCr alloy, said Ta layer is selectively patterned and selectively removed so that the liquid flow path member is formed in a portion where the layer formed by said TaCr alloy is exposed by said removing.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board has the heaters formed with high precision to reduce their areas. It also has provisions to protect the electrode wires against corrosion and prevent a progress of corrosion. The substrate is deposited with the thin first electrodes made of a corrosion resistant metal. This is further deposited with the resistor layer. The second electrodes made of aluminum are deposited to overlap the first electrodes to form the heater without causing large dimensional variations among the heaters. With this construction, if a defect should occur in a protective layer on or near the heater, a progress of corrosion can effectively be prevented because the material of the resistor layer is more resistant to encroachment than aluminum and the first electrodes are corrosion resistant.

Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.

Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board reduces areas of the heaters to achieve higher printing resolution and image quality. This board also prevents a degradation of thermal energy efficiency and reduces power consumption. The protective insulation layer for the electrode wire layer is formed of two layers and one of the two layers is removed from above the heater to improve the heat energy efficiency. The resistor layer is deposited over the electrode wire layer. The patterning for removing the protective insulation layer is done in a wider range than a gap of the electrode wire layer, the gap being used to form the heater. Further, by forming the electrode wires in two layers, a possible reduction in an effective bubble generation area of the heater can be prevented.

Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection. This board has the heaters formed with high precision to reduce their areas. It has provisions to protect the electrode wires against corrosion and prevent a progress of corrosion. The substrate is deposited with the thin first electrodes made of a corrosion resistant metal. Over the first electrodes the second electrodes made of aluminum are formed. The second electrodes are deposited with a resistor layer. The heater is formed in the gap between the first electrodes. With this construction, the heaters are formed without large dimensional variations among them. Should a defect occur in a protective layer above or near the heaters, a progress of corrosion can effectively be prevented because the material of the resistor layer is more resistant to encroachment than aluminum and the first electrodes are corrosion resistant.

Abstract: A base plate for use in a recording head, which is used by an ink jet head for printing by discharging ink onto a recording medium, the recording head being provided with energy converting element for discharging the ink by generating a bubble in the ink by converting electric energy to thermal energy, and an anti-cavitation film to protect the energy converting element from shocks generated at the time of bubble growth and extinction, the anti-cavitation film being used as electrodes for detecting the state of the ink by energizing the ink. The base plate comprises a first diode having the a cathode thereof connected to the anti-cavitation film and an anode thereof connected to a ground potential; and a second diode having the anode thereof connected to the anti-cavitation film and the cathode thereof connected to a power supply potential.

Abstract: In order to form a more homogenous heat generating resistive layer, the present invention provides a method of manufacturing a substrate for an ink jet recording head having a support which has an insulative layer on its surface, a pair of electrode layers disposed on the surface of the support, and a heat generating resistive layer which continuously covers the pair of electrode layers and a section between the pair of electrode layers. The method includes the step of forming an electrode layer on the support and the step of forming the pair of electrode layers by etching the electrode layer. In the step of forming the pair of electrode layers by etching the electrode layer, by etching a surface portion of the insulative layer positioned between the pair of insulative layers, a recess is formed in the surface portion of the insulative layer.

Abstract: A metallic slide fastener element in which an exposed portion outside of an element is finished uniformly with a high smoothness and the fixing strength to a fastener tape is intensified, and a method for effectively manufacturing the same element, wherein a metallic flat type wire rod is placed on a die and the flat type wire rod is punched out with a punch so as to produce a slide fastener element, and at this time, a mouth on a punch side of the die or a peripheral edge of the die is chamfered at a radius of 0.01 to 1.0 mm and a clearance between the punch and the die is set to 0 to 30 ?m, so that an element, which has a cut surface comprising a shear surface of 80% or more and a fracture surface of less than 20% and is suitable as a slide fastener to be attached to a high quality product, is obtained.

Abstract: This invention relates to a printhead substrate capable of suppressing an increase in wiring width and an increase in the size of a substrate formed by a film forming process while increasing the number of simultaneously driven printing elements in order to improve the printing performance, a printhead using the substrate, and a printing apparatus using the printhead. The wiring lines of the substrate are formed into a common wiring line, and energy applied to a heating resistance element is prevented from deviating from a stable ink discharge range owing to the difference in the number of simultaneously driven heating resistance elements. For this purpose, a driving element is greatly downsized in comparison with a conventional one, and the operation region of a MOS transistor is shifted from the non-saturation region to the saturation region.

Abstract: A number of steps is reduced by manufacturing an electrode pad connecting a liquid discharge head to an external wiring by the same step of a common wiring for supplying an electric power to a discharge energy generating portion. A number of manufacturing steps of a head is reduced by forming a substrate for a liquid discharge head having an electrode pad and a common wiring for supplying an electric power to a discharge energy as a metal film made of the same material as the electrode pad in accordance with a plating in a step of forming the common wiring of the metal film in accordance with a plating.

Abstract: A recording head substrate allowing an increased number of the exothermic bodies driven at a time without increasing the substrate size so as to increase a number of nozzles arranged in high density. The recording head substrate includes a plurality of electrothermal conversion members having exothermic bodies respectively corresponding to a plurality of discharge ports; a plurality of drive elements for driving the exothermic bodies; common wiring A connected to the exothermic bodies; and common wiring B connected to the drive elements; and an electrode pad connected to the common wiring A and the common wiring B. A number of the exothermic bodies driven at a time is determined by (RlineA+RlineB)/(Rh+Rd)<0.05/(0.95 n?1).

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) remains on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.