Patents by Inventor Teruo Shimase

Teruo Shimase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8146432
    Abstract: A tilt and vibration sensor incorporating a plurality of electrodes and a conductive spherical. body which is turned on and off by the moving displacement of the spherical body, and which may be remarkably reduced in size and may have high performance and high operating sensitivity, high durability, and high reliability; and a method of manufacturing the sensor. The case (1) of the sensor comprises a case body (5) formed of a non-conductive material having such excellent gas-barrier property and heat resistance that can stop the transmission of gases which affects the on/off operation of the sensor due to the moving displacement of the conductive spherical body (4) and a cover body (7) sealing airtight the opening part (6) of the case body.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: April 3, 2012
    Assignee: G-Device Corporation
    Inventor: Teruo Shimase
  • Publication number: 20110088478
    Abstract: A tilt and vibration sensor incorporating a plurality of electrodes and a conductive spherical. body which is turned on and off by the moving displacement of the spherical body, and which may be remarkably reduced in size and may have high performance and high operating sensitivity, high durability, and high reliability; and a method of manufacturing the sensor. The case (1) of the sensor comprises a case body (5) formed of a non-conductive material having such excellent gas-barrier property and heat resistance that can stop the transmission of gases which affects the on/off operation of the sensor due to the moving displacement of the conductive spherical body (4) and a cover body (7) sealing airtight the opening part (6) of the case body.
    Type: Application
    Filed: October 26, 2010
    Publication date: April 21, 2011
    Inventor: Teruo SHIMASE
  • Patent number: 7845234
    Abstract: Provided are a tilted vibration sensor incorporating a plurality of electrodes and a conductive spherical body which is turned on and off by the moving displacement of the spherical body, and which may be remarkably reduced in size and may have high performance and high operating sensitivity, high durability, and high reliability; and a method of manufacturing the sensor. The case (1) of the sensor comprises a case body (5) formed of a non-conductive material having such excellent gas-barrier property and heat resistance that can stop the transmission of gases which affects on the on/off operation of the sensor due to the moving displacement of the conductive spherical body (4) and a cover body (7) sealing airtight the opening part (6) of the case body. In the method of manufacturing the vibration sensor, moisture and particulate impurities affecting the on/off operation are removed from the hollow part (2) of the case (1), and the hollow part is evacuated.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: December 7, 2010
    Assignee: G-Device Corporation
    Inventor: Teruo Shimase
  • Publication number: 20090266168
    Abstract: Provided are a tilted vibration sensor incorporating a plurality of electrodes and a conductive spherical body which is turned on and off by the moving displacement of the spherical body, and which may be remarkably reduced in size and may have high performance and high operating sensitivity, high durability, and high reliability; and a method of manufacturing the sensor. The case (1) of the sensor comprises a case body (5) formed of a non-conductive material having such excellent gas-barrier property and heat resistance that can stop the transmission of gases which affects on the on/off operation of the sensor due to the moving displacement of the conductive spherical body (4) and a cover body (7) sealing airtight the opening part (6) of the case body. In the method of manufacturing the vibration sensor, moisture and particulate impurities affecting the on/off operation are removed from the hollow part (2) of the case (1), and the hollow part is evacuated.
    Type: Application
    Filed: August 17, 2006
    Publication date: October 29, 2009
    Inventor: Teruo Shimase