Abstract: According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

Abstract: According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

Abstract: According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed.

Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 ?m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

Abstract: According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.

Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

Abstract: A steel sheet for an inner magnetic shield has a ratio of the anhysteretic magnetic permeability in the rolling direction to the anhysteretic magnetic permeability in the transversal direction, which is not higher than 0.7 or not lower than 1.4, preferably not higher than 0.5 or not lower than 2.0. A higher value of the two anhysteretic magnetic permeability values in the rolling direction and in the transversal direction is not lower than 18000. The inner magnetic shield formed of the particular steel sheet has a substantially truncated pyramid body which has a pair of short side members of a screen and a pair of long side members of a screen. The short side members are joined to the long side members at edge portions of the truncated pyramidal inner magnetic shield. The direction, in which the anhysteretic magnetic permeability of the steel sheet is the higher value, corresponds to the horizontal plane direction of the short side member.

Abstract: A steel sheet for an explosion-proof band contains 0.001 to 0.05% by mass of C, 0.2 to 1% by mass of Si, 0.5 to 2.3% by mass of Mn, 0.02 to 0.12% by mass of P, not higher than 0.005% by mass of 0, not higher than 0.020% by mass of S, and not higher than 0.005% by mass of N, and has not higher than 100% of a P segregation rate within the steel sheet, which is represented by (Pmax?Pave)×100/Pave, where Pmax denotes the maximum P concentration within the steel sheet, and Pave denotes the average P concentration within the steel sheet, 10 to 25 ?m of an average ferrite grain size, and not lower than 10,000 of an anhysteretic magnetic permeability.

Abstract: A photo-interrupter includes a light-emitting-side internal device provided with a light-emitting chip and formed by molding, and a light-receiving-side internal device provided with a light-receiving chip and formed by molding. The light-emitting-side internal device has a light output face, and the light-receiving-side internal device has a light input face. The light-emitting-side internal device and the light-receiving-side internal device are held by a casing, such that the light output face and the light input face are opposite to each other with a gap interposed therebetween. The light output face and the light input face are respectively disposed in first and second slits formed in the casing. The light output face and the light input face are respectively flush with surfaces of the casing around the first and second slits.