Patents by Inventor Teruo Wakano

Teruo Wakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and its manufacture
    Patent number: 4823234
    Abstract: A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
    Type: Grant
    Filed: July 1, 1986
    Date of Patent: April 18, 1989
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Akira Konishi, Teruo Wakano