Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.

Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.

Abstract: A preparation process of phenol aralkyl resin from phenol compound and aralkyl compound by controlling the temperature of reaction mass in the range of 70 to 240.degree. C. and simultaneously controlling the temperature of vapor phase potion and vapor-liquid interface portion of manufacturing equipment so as to keep the wall surface of the vapor phase portion and vapor-liquid interface portion in a wet state. The invention can prevent scale adhesion to the interior of manufacturing equipment, remarkably reduce the number of washing and scale removing procedures on the manufacturing equipment, and enable efficient manufacture of phenol aralkyl resin. When the phenol aralkyl resin obtained is used for a molding material, molded articles having excellent heat resistance and high reliability can be provided.

Abstract: An allyletherificated phenol aralkyl resin is obtained through the reaction of a phenol aralkyl resin with an allyl halide in the presence of a base in an organic solvent at room temperature to 100.degree. C. and changed into an allylated phenol aralkyl resin at 160.degree.-250.degree. C. through Claisen rearrangement. The two resins are low in melt viscosity. Epoxy resin compositions containing the allylated phenol aralkyl resin as the curing agent give cured products being excellent in heat and moisture resistances.

Abstract: A phenolic resin composition comprises a mixture of 100 parts by weight of a phenol aralkyl resin and 5 to 60 parts by weight of a novolak type phenolic resin having a content of binuclear components of not more than 10% by area, and a content of trinuclear components of not less than 50% by area and a sum content of tri- and tetra-nuclear components of 75% by area based on the total novolak phenolic resin except for the binuclear components, and an epoxy-cured product obtained by curing an epoxy resin while using the phenolic resin composition as set forth in claim 1 as a curing agent. The phenolic resin composition has a low viscosity and, when it is used as a curing agent for epoxy resins, the resulting epoxy-cured product has a low water absorption rate, is excellent in resistance to moisture and has a high glass transition temperature as compared with the cured product obtained using a novolak type phenolic resin as a curing agent.

Abstract: Indene compounds of the formula ##STR1## wherein X represents a hydrogen atom, a halogen atom, a hydroxyl group or a methyl group, and y is 0 or an integer of 1 to 3, are produced by either heat-decomposing indene compounds of the formula ##STR2## wherein X and y are as defined, in the presence of an acid or alkaline catalyst; or heat-decomposing isopropenyl phenols of the formula ##STR3## wherein X and y are as defined, or oligomers or polymers thereof in the presence of an acid catalyst. 5-Hydroxy-1,1,3-trimethyl-2-indene corresponding to formula (III) is a novel compound.

Abstract: An aromatic polyester amide is produced by reacting hydroxyphenyl-aminophenyl-propane with aromatic dicarboxylic acid dihalide in the presence of an inert organic solvent, and bringing the organic solvent phase containing the mixture of the reaction products of the above reaction into contact with an aqueous phase containing an acid-acceptor, whereby completing polycondensation reaction. In order to control the dissolution of water into the organic solvent phase while maintaining an adequate level of miscibility between the organic solvent phase and the aqueous phase, a neutral salt of inorganic electrolyte, such as sodium chloride, is added to the aqueous phase containing the acid-acceptor.

Abstract: A process for preparing 2-(4'-hydroxyaryl)-2-(4'-aminoaryl)-propanes of the general formula ##STR1## wherein R represents a hydrogen or halogen atom or an alkyl, aryl, nitro, nitrile, acyl, acyloxy or amino group, R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 and R.sup.3, independently from each other, represent a hydrogen or halogen atom, a nitro group or an alkyl group having 1 to 4 carbon atoms,which comprises reacting (A) at least one isopropenyl phenol compound selected from the group consisting of isopropenyl phenol derivatives of the general formula ##STR2## wherein R is as defined, and di- to eicosa-mers of said isopropenyl phenol derivatives with (B) an aromatic amine of the general formula ##STR3## wherein R.sup.1 , R.sup.2 and R.sup.3 are as defined, in the presence of 0.00001 to 0.008 mole, per mole of said isopropenylphenol compound (A) calculated as a monomer, of a acid catalyst and in the presence or absence of a phenolic solvent.

Abstract: Indene compounds of the formula ##STR1## wherein X represents a hydrogen atom, a halogen atom, a hydroxyl group or a methyl group, andy is 0 or an integer of 1 to 3,are produced by either heat-decomposing indene compounds of the formula ##STR2## wherein X and y are as defined, in the presence of an acid or alkaline catalyst; or heat-decomposing isopropenyl phenols of the formula ##STR3## wherein X and y are as defined,or oligomers or polymers thereof in the presence of an acid catalyst. 5-Hydroxy-1,1,3-trimethyl-2-indene corresponding to formula (III) is a novel compound.

Abstract: Disclosed is a heat-resistant and fast-curing thermosetting resin composition suitably for insulating materials and comprising (a) a bismaleimide and/or a polymaleimide compound and (b) at least one compound selected from alkenylphenol derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated compound.

Abstract: A novel process for producing alkenyl phenols, which comprises continuously feeding a dihydroxydiphenyl alkane such as 2,2-(4,4'-dihydroxydiphenyl)propane, 2,2-(4,4'-dihydroxy-3,3'-dimethyldiphenyl)propane, 2,2-(4,4'-dihydroxydiphenyl)butane, 2,2-(4,4'-dihydroxydiphenyl)-4-methylpentane, 1,1,1-(4,4'-dihydroxytriphenyl)ethane and 1,1-(4,4'-dihydroxydiphenyl)cyclohexane into a high-boiling inert organic reaction medium such as an alkylnaphthalene containing a basic catalyst and heated at 150.degree. to 250.degree. C. under 10 to 100 mmHg while maintaining the concentration of the dihydroxydiphenyl alkane in the reaction medium at not more than 30% by weight, thereby cleaving it in the reaction medium; and continuously distilling off the cleavage product out of the reaction system and recovering it. This process can afford the corresponding highly pure alkenyl phenol as a monomer and/or its polymer almost quantitatively.

Abstract: A novel process for producing isopropenyl phenol such as p-isopropenyl phenol which comprises continuously feeding oligomers of isopropenyl phenol having a degree of polymerization of 2 to 5 into a high-boiling inert organic reaction medium such as an alkylnaphthalene heated at 150.degree. to 250.degree. C. under a pressure of 10 to 100 mmHg while maintaining the concentration of the oligomers in the reaction medium at not more than 30% by weight, thereby thermally decomposing the oligomers in the reaction medium; and continuously distilling off the resulting isopropenyl phenol out of the reaction system and recovering it. The process almost quantitatively gives isopropenyl phenol having reduced contents of impurities.

Abstract: A novel trimer of p-isopropenyl phenol of the structure ##STR1## which is useful as a material or a curing agent for epoxy resins. The linear trimer includes a cis-isomer (m.p. 225.5.degree.-227.degree. C.) and a trans-isomer (m.p. 167.degree.-168.degree. C.). It is prepared by reacting p-isopropenyl phenol or its linear polymer in the presence of an acid catalyst such as sulfuric acid, boron fluoride or activated clay in an aromatic hydrocarbon, halogenated hydrocarbon, substituted aromatic hydrocarbon or aprotic polar solvent (e.g., benzene, carbon tetrachloride, nitrobenzene or dioxane).