Abstract: A deposition apparatus for forming a thin film by depositing material particles separated from a deposition material on a deposition object by irradiation with a plasma supplied from a plasma generator into a chamber including a hearth accommodating the deposition material, and a capturing mechanism installed near the hearth and outside the range of a moving region of the material particles moving toward the deposition object. The moving region is determined by a width in an incident direction in which the plasma is incident on the deposition material, and the width of the deposition object 10. The capturing mechanism captures at least some material particles separated from the deposition material and existing outside the range of the moving region.

Abstract: A substrate support mechanism of the present invention, which holds the inner rim of a disc substrate having an opening at its center, comprises: a hollow cylindrical member; a central shaft having a tapered portion disposed in the cylindrical member so as to be axially pushed by a first spring; and a plurality of radially movable members, each of which is pushed inwardly by a second spring and has a click to grip the inner rim; whereby the axial motion of the central shaft is converted by the tapered portion to the radial motion of said radially movable members to grip and release said substrate. A substrate rotation device includes a mechanism for axially moving the cylindrical member; a mechanism for axially moving the central shaft; and a mechanism for rotating the cylindrical member in addition to the substrate support mechanism.

Abstract: A drive member has a spiral magnetic coupling in its upper surface configured from a N pole spiral and a S pole spiral. A carrier can slidably move in the shaft direction to pass through a point that is a fixed distance from the upper surface of the drive member, and a magnetic coupling is provided at an interval the same as the interval between the N pole spiral and the S pole spiral of the spiral magnetic coupling. The carrier is moved directly by the rotational operation of the drive member. The arranged interval (d) of the drive member along a conveying path is a positive integer multiple of twice the interval (p) between the N pole spiral and S pole spiral of the spiral magnetic coupling. The carrier can be moved smoothly and without interruption, even though a transfer part divides the magnetic carrying path between successive chambers.

Abstract: A drive member has a spiral magnetic coupling in its upper surface configured from a N pole spiral and a S pole spiral. A carrier can slidably move in the shaft direction to pass through a point that is a fixed distance from the upper surface of the drive member, and a magnetic coupling is provided at an interval the same as the interval between the N pole spiral and the S pole spiral of the spiral magnetic coupling. The carrier is moved directly by the rotational operation of the drive member. The arranged interval (d) of the drive member along a conveying path is a positive integer multiple of twice the interval (p) between the N pole spiral and S pole spiral of the spiral magnetic coupling. The carrier can be moved smoothly and without interruption, even though a transfer part divides the magnetic carrying path between successive chambers.

Abstract: A sputtering device is provided in which at least one target is sputtered by sputtering discharge to produce a film of target material on at least the first surface of a substrate. The sputtering device has a principal rotating mechanism that rotates the at least one target about an axis of revolution coaxial with the central axis of the substrate. The target is positioned offset from and circumferential to the central axis of the substrate coaxial with the axis of revolution. A magnet mechanism for magnetron discharge of the sputtering discharge forms a magnetic field asymmetrical to a central axis of the target and is rotated by an auxiliary rotating mechanism. The principal rotating mechanism integrates rotation of the targets with the magnet mechanism.

Abstract: A drive member has a spiral magnetic coupling in its upper surface configured from a N pole spiral and a S pole spiral. A carrier can slidably move in the shaft direction to pass through a point that is a fixed distance from the upper surface of the drive member, and a magnetic coupling is provided at an interval the same as the interval between the N pole spiral and the S pole spiral of the spiral magnetic coupling. The carrier is moved directly by the rotational operation of the drive member. The arranged interval (d) of the drive member along a conveying path is a positive integer multiple of twice the interval (p) between the N pole spiral and S pole spiral of the spiral magnetic coupling. The carrier can be moved smoothly and without interruption, even though a transfer part divides the magnetic carrying path between successive chambers.

Abstract: A sputtering device is provided in which at least one target is sputtered by sputtering discharge to produce a film of target material on at least the first surface of a substrate. The sputtering device has a principal rotating mechanism that rotates the at least one target about an axis of revolution coaxial with the central axis of the substrate. The target is positioned offset from and circumferential to the central axis of the substrate coaxial with the axis of revolution. A magnet mechanism for magnetron discharge of the sputtering discharge forms a magnetic field asymmetrical to a central axis of the target and is rotated by an auxiliary rotating mechanism. The principal rotating mechanism integrates rotation of the targets with the magnet mechanism.

Abstract: A substrate transfer system is used in an in-line film deposition system. The substrate transfer system is provided with an auxiliary vacuum chamber and a main vacuum chamber. The auxiliary vacuum chamber has a plurality of first substrate cassettes. The main vacuum chamber is communicated with another vacuum chamber through which carriers are transferred along a transport path. The main vacuum chamber has two robots and a plurality of second substrate cassettes arranged in parallel on which the substrates is placed. The second substrate cassettes are arranged between the two robots. The substrates are disk-shaped substrates having center holes. The center holes are utilized as hook parts during a pickup operation. Thereby the method of mounting substrates in the holders of carriers etc. is improved without changing the operating speed of the robots. Therefore the amount of substrates transported per unit time is increased and the processing capacity of the substrate processing system is enhanced.

Abstract: A substrate support mechanism of the present invention, which holds the inner rim of a disc substrate having an opening at its center, comprises: a hollow cylindrical member; a central shaft having a tapered portion disposed in the cylindrical member so as to be axially pushed by a first spring; and a plurality of radially movable members, each of which is pushed inwardly by a second spring and has a click to grip the inner rim; whereby the axial motion of the central shaft is converted by the tapered portion to the radial motion of said radially movable members to grip and release said substrate.

Abstract: A substrate transfer system is used in an in-line film deposition system. The substrate transfer system is provided with an auxiliary vacuum chamber and a main vacuum chamber. The auxiliary vacuum chamber has a plurality of first substrate cassettes. The main vacuum chamber is communicated with another vacuum chamber through which carriers are transferred along a transport path. The main vacuum chamber has two robots and a plurality of second substrate cassettes arranged in parallel on which the substrates is placed. The second substrate cassettes are arranged between the two robots. The substrates are disk-shaped substrates having center holes. The center holes are utilized as hook parts during a pickup operation. Thereby the method of mounting substrates in the holders of carriers etc. is improved without changing the operating speed of the robots. Therefore the amount of substrates transported per unit time is increased and the processing capacity of the substrate processing system is enhanced.