Patents by Inventor Terutaka Maruyama

Terutaka Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7577406
    Abstract: A wireless transceiver for a keyless entry system of an automotive vehicle includes: a circuit board having a circuit part disposed thereon; and a resin mold for molding the circuit board. The resin mold molds both of the circuit board and the circuit part, and the resin mold has a card shape. The resin mold has no connection portion of a casing so that the transceiver has high water resistance and high impact resistance.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: August 18, 2009
    Assignee: DENSO CORPORATION
    Inventors: Mitsuru Nakagawa, Terutaka Maruyama
  • Patent number: 6959181
    Abstract: Data formulated according to a user's request signal is transmitted from a transmitter device to a receiver device under a wireless or a wired system. The transmitter device includes a transmission controller that formulates the data to be transmitted and memorizes the request signal as a backup signal. If the data transmission is not completed due to a power source trouble such as a voltage drop, the data to be transmitted is automatically formulated again based on the backup signal and sent out to the receiver. If the data transmission is successful, the backup signal is eliminated from a memory. Thus, the data requested by the user is transmitted without fail even if the transmitter becomes temporarily inoperative.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: October 25, 2005
    Assignee: Denso Corporation
    Inventors: Terutaka Maruyama, Akihiro Sasaki, Takashi Harada
  • Publication number: 20050136852
    Abstract: A wireless transceiver for a keyless entry system of an automotive vehicle includes: a circuit board having a circuit part disposed thereon; and a resin mold for molding the circuit board. The resin mold molds both of the circuit board and the circuit part, and the resin mold has a card shape. The resin mold has no connection portion of a casing so that the transceiver has high water resistance and high impact resistance.
    Type: Application
    Filed: December 7, 2004
    Publication date: June 23, 2005
    Inventors: Mitsuru Nakagawa, Terutaka Maruyama
  • Patent number: 6882541
    Abstract: Of an IC card, an IC is mounted on a surface of a circuit board (FPC) including a hard plate member that is attached on the other surface of the circuit board. Both surfaces of the circuit board having the IC and plate member are covered by a hard material member of electric insulating. Therefore, stress load applied to the IC can be restricted. Further, the circuit board along with the hard material member is divided into multiple portions that are connected using a flexible electric wiring. This can provide sufficient flexibility to the IC card, resulting in enhancement of a preventive effect in breakage or damage of the IC card.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: April 19, 2005
    Assignee: Denso Corporation
    Inventors: Terutaka Maruyama, Mitsuru Nakagawa
  • Publication number: 20040190267
    Abstract: Of an IC card, an IC is mounted on a surface of a circuit board (FPC) including a hard plate member that is attached on the other surface of the circuit board. Both surfaces of the circuit board having the IC and plate member are covered by a hard material member of electric insulating. Therefore, stress load applied to the IC can be restricted. Further, the circuit board along with the hard material member is divided into multiple portions that are connected using a flexible electric wiring. This can provide sufficient flexibility to the IC card, resulting in enhancement of a preventive effect in breakage or damage of the IC card.
    Type: Application
    Filed: March 9, 2004
    Publication date: September 30, 2004
    Applicant: DENSO CORPORATION
    Inventors: Terutaka Maruyama, Mitsuru Nakagawa
  • Publication number: 20030104847
    Abstract: Data formulated according to a user's request signal is transmitted from a transmitter device to a receiver device under a wireless or a wired system. The transmitter device includes a transmission controller that formulates the data to be transmitted and memorizes the request signal as a backup signal. If the data transmission is not completed due to a power source trouble such as a voltage drop, the data to be transmitted is automatically formulated again based on the backup signal and sent out to the receiver. If the data transmission is successful, the backup signal is eliminated from a memory. Thus, the data requested by the user is transmitted without fail even if the transmitter becomes temporarily inoperative.
    Type: Application
    Filed: September 30, 2002
    Publication date: June 5, 2003
    Inventors: Terutaka Maruyama, Akihiro Sasaki, Takashi Harada
  • Patent number: 5574416
    Abstract: An electromagnetic relay is composed of a coil wound around magnetic core, a U-shaped magnetic pole member connected to an end of the magnetic core and provides a space, a yoke member connected to the other end of the magnetic core, an armature movably connected to the yoke and disposed in the space, a permanent magnet secured to the armature near the magnetic core and supporting member supporting the armature. Since the permanent magnet is disposed near the magnetic core, magnetic flux of the permanent magnet can be utilized effectively and, therefore, the size of the relay can be reduced.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: November 12, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Terutaka Maruyama, Seiji Kawai, Hiroyuki Hirata