Abstract: A photo-alignment thermosetting liquid crystal composition including: a side-chain liquid crystal polymer which contains a liquid crystal constitutional unit containing a liquid crystal moiety in a side chain and a non-liquid crystal constitutional unit containing an alkylene group in a side chain, a copolymer which contains a photo-alignment constitutional unit containing a photo-alignment group in a side chain and a thermally crosslinkable constitutional unit containing a thermally crosslinkable group in a side chain, and in which the photo-alignment constitutional unit does not contain a linear alkylene group between the photo-alignment group and a monomer unit, and a thermal crosslinking agent for bonding to the thermally crosslinkable group of the thermally crosslinkable constitutional unit.

Abstract: A semiconductor device includes a first semiconductor chip having a non-volatile memory array which has a first memory area for storing input information of usual operation, and a second memory area for storing historical information of an electrical characteristic test of the first memory area. The device further includes a second semiconductor chip having a volatile memory array with a third memory area for storing input information of usual operation. Historical information of an electrical characteristic test of the third memory area of the second semiconductor chip is stored into the second memory area of the first semiconductor chip.

Abstract: There is provided an electrical characteristic test technique for a semiconductor device that can shorten the time required for a next probe test after a wafer level burn-in test, prevent leak of defective product to an assembling process and moreover easily realizes the analysis of cause for generation of a fault after delivery of products to customers.

Abstract: There is provided an electrical characteristic test technique for a semiconductor device that can shorten the time required for a next probe test after a wafer level burn-in test, prevent leak of defective product to an assembling process and moreover easily realizes the analysis of cause for generation of a fault after delivery of products to customers.

Abstract: A semiconductor memory is provided with a first memory cell group, a second memory cell group, a first register for a serial output operation for holding information related to the first memory cell group, a second register for a serial output operation for holding information related to the second memory cell group, and transfer means for transferring information related to either the first or second memory cell group to either the first or second serial output register. By virtue of this arrangement, while the information transferred to the first serial output register is being serially output therefrom, information can simultaneously be transferred to the second serial output register by the transfer means.