Patents by Inventor Terutoki KASAMATSU

Terutoki KASAMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10930584
    Abstract: In an electronic component, a first ground land and a first hot land are provided on a mounting surface of a first substrate. A semiconductor chip is mounted on a first surface and a first ground land and a first hot land are provided on a second surface of a second substrate, and the second surface faces the mounting surface of the first substrate. A three-terminal capacitor is between the first substrate and second substrates.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: February 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Terutoki Kasamatsu, Syuichi Nabekura
  • Publication number: 20190164884
    Abstract: In an electronic component, a first ground land and a first hot land are provided on a mounting surface of a first substrate. A semiconductor chip is mounted on a first surface and a first ground land and a first hot land are provided on a second surface of a second substrate, and the second surface faces the mounting surface of the first substrate. A three-terminal capacitor is between the first substrate and second substrates.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Inventors: Terutoki KASAMATSU, Syuichi NABEKURA