Patents by Inventor Terutoshi Momose

Terutoshi Momose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210168969
    Abstract: A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.
    Type: Application
    Filed: May 30, 2019
    Publication date: June 3, 2021
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinichiro TAKAHASHI, Takayuki OTA, Kazunori ODA, Toshihiko TAKEDA, Kiyotaka TAKEMATSU, Terutoshi MOMOSE, Yoko NAKAMURA
  • Publication number: 20200404802
    Abstract: A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.
    Type: Application
    Filed: September 28, 2018
    Publication date: December 24, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinichiro TAKAHASHI, Takayuki OTA, Kiyotaka TAKEMATSU, Kenro HIRATA, Taizo HASHIMOTO, Yoko NAKAMURA, Kazunori ODA, Toshihiko TAKEDA, Terutoshi MOMOSE
  • Publication number: 20170103777
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.
    Type: Application
    Filed: December 23, 2016
    Publication date: April 13, 2017
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
  • Patent number: 9564153
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: February 7, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
  • Publication number: 20150079424
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
  • Patent number: 8927122
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: January 6, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
  • Patent number: 8399774
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: March 19, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
  • Patent number: 8308967
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20120090878
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
    Type: Application
    Filed: November 23, 2011
    Publication date: April 19, 2012
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi HITOMI, Hiroaki MIYAZAWA, Shinji KUMON, Terutoshi MOMOSE
  • Patent number: 8097811
    Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: January 17, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
  • Patent number: 8066891
    Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: November 29, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
  • Patent number: 8040634
    Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: October 18, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
  • Publication number: 20110108519
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 12, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya SAKAYORI, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20100047626
    Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.
    Type: Application
    Filed: April 14, 2008
    Publication date: February 25, 2010
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
  • Publication number: 20090310260
    Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.
    Type: Application
    Filed: July 14, 2006
    Publication date: December 17, 2009
    Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
  • Publication number: 20080247131
    Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.
    Type: Application
    Filed: April 4, 2008
    Publication date: October 9, 2008
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
  • Patent number: 7226806
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: June 5, 2007
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20070120229
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable byawet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20070026678
    Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
    Type: Application
    Filed: October 6, 2006
    Publication date: February 1, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
  • Publication number: 20060073316
    Abstract: This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet-etching the laminate by the use of a basic fluid. The insulating layer of the laminate is composed of plural layers of polyimide, every constituent layer exhibits a mean etching rate of 0.5 ?M/min or more by a 50 wt % aqueous solution of KOH at 80° C., the layers in contact with the stainless steel substrate and the metal foil are those of polyimide (B) exhibiting a glass transition temperature of 300° C. or less and the adhesive strength between the layer of polyimide (B) and either the stainless steel substrate or the metal foil is 0.5 kN/m or more.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 6, 2006
    Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose, Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Michiaki Uchiyama, Shigeki Kawano