Patents by Inventor Teruyoshi Abe

Teruyoshi Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8004128
    Abstract: A rotating electrical machine having an RF-IC chip for detecting a rotation and also having a stator and a rotor. When a compact RF-IC chip is used as the RF-IC chip, the chip can detect the rotation of the rotating electrical machine.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 23, 2011
    Assignee: Hitachi, Ltd.
    Inventor: Teruyoshi Abe
  • Patent number: 7777389
    Abstract: A rotating electrical machine comprises a stator and a rotor; the stator comprising a stator core having teeth and slots, and stator windings disposed in the slots, wherein the stator core is made of laminated steel sheets, teeth and slots of the steel sheet are made by etching, and the thickness of the steel sheet is between 0.05 mm and 0.30 mm. Specifically, it is preferable that the steel sheet used herein be a silicon steel sheet containing crystalline particles.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: August 17, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Teruyoshi Abe, Motoya Ito, Fumio Tajima, Yoshihisa Ishikawa
  • Publication number: 20090033180
    Abstract: A rotating electrical machine having an RF-IC chip for detecting a rotation and also having a stator and a rotor. When a compact RF-IC chip is used as the RF-IC chip, the chip can detect the rotation of the rotating electrical machine.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 5, 2009
    Inventor: Teruyoshi Abe
  • Publication number: 20080238241
    Abstract: An efficient and high-performance commutator motor in which both torque enhancement and iron loss reduction are achieved is provided by ensuring a sufficient area occupied by field windings wound on main poles and further suppressing the influence of armature counteractive magnetic flux and reducing pulsating torque. The commutator motor includes a stator and an armature. The stator includes a stator iron core having the main poles and slots and the field windings disposed in the slots. The armature includes an armature iron core having slots and teeth and armature windings wound in the slots. The stator and armature iron cores are formed of laminated steel sheets. The iron cores are formed by etching process. Multiple through holes are formed in the main poles opposed to the air gap positioned on the forward side in the direction of armature rotation by etching process.
    Type: Application
    Filed: January 24, 2008
    Publication date: October 2, 2008
    Inventors: Tsukasa TANIGUCHI, Yoshihisa Ishikawa, Teruyoshi Abe
  • Publication number: 20080238237
    Abstract: An induction machine has a stator and rotor. The stator comprises teeth and slots and stator winding disposed in the slots. The rotor comprises a rotor core having teeth and slots and a rotor-conductor disposed in the rotor slots. Both of the stator core and rotor core are made of laminated steel sheets, and the teeth and slots made of steel sheets are formed by etching.
    Type: Application
    Filed: February 6, 2008
    Publication date: October 2, 2008
    Inventors: Kazuo Nishihama, Teruyoshi Abe, Yoshihisa Ishikawa, Hiroyuki Mikami
  • Publication number: 20080224574
    Abstract: A stepping motor comprising: a stator iron core with a plurality of salient poles each having a small tooth at the tip thereof and stator coils each disposed between the salient poles; a rotor core with a plurality of teeth in the faces opposite to the stator; and permanent magnets sandwiched by the rotor cores in an axial direction, wherein the stator iron core and the rotor core are formed by laminated steel plates. The salient poles of the stator iron cores of the steel plates and small teeth are shaped by etching, and a thickness of the steel plates is 0.05 to 0.30 mm.
    Type: Application
    Filed: January 24, 2008
    Publication date: September 18, 2008
    Inventors: Yuji Enomoto, Yoshihisa Ishikawa, Teruyoshi Abe
  • Publication number: 20080136285
    Abstract: The spindle motor has a stator and rotor. The stator has a stator core comprising a yoke and salient poles and also includes a stator coil. The stator core is formed by laminated steel sheets. The salient poles made of the steel sheets are formed by etching. The steel sheet is 0.05 to 0.30 mm thick. The steel sheet used in the present invention is preferably a silicon steel sheet having crystal particles. The iron loss and cogging torque of the inventive spindle motor are reduced.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 12, 2008
    Inventors: Fumio Tajima, Teruyoshi Abe, Motoya Ito, Yoshihisa Ishikawa, Masashi Kitamura, Toshuyuki Ajima
  • Publication number: 20080012445
    Abstract: A rotating electrical machine comprises a stator and a rotor; the stator comprising a stator core having teeth and slots, and stator windings disposed in the slots, wherein the stator core is made of laminated steel sheets, teeth and slots of the steel sheet are made by etching, and the thickness of the steel sheet is between 0.05 mm and 0.30 mm. Specifically, it is preferable that the steel sheet used herein be a silicon steel sheet containing crystalline particles.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 17, 2008
    Inventors: TERUYOSHI ABE, Motoya Ito, Fumio Tajima, Yoshihisa Ishikawa
  • Patent number: 7218266
    Abstract: An electromagnetic wave absorber for use in the high frequency range above 1 Ghz and a composite member are characterized by the fact that magnetic metal grains are covered with ceramic above 20 volume %. Further, a method of manufacturing the electromagnetic absorber and the composite member is characterized by the fact that composite magnetic particles, in which a plurality of magnetic metal grains and ceramic are unified, are formed through a mechanical alloying method applied to a composite powder composed of magnetic metal powder and ceramic powder. The electromagnetic wave absorber can be used in a semiconductor device, an optical sending module, an optical receiving module, an optical sending and receiving module, an automatic tollgate in which erroneous operation due to electromagnetic wave disturbance is provided by use of the electromagnetic wave absorber.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: May 15, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Tadashi Fujieda, Shinzou Ikeda, Sai Ogawa, Teruyoshi Abe, Yasuhisa Aono
  • Patent number: 6919387
    Abstract: An electromagnetic wave absorber for use in the high frequency range above 1 Ghz and a composite member are characterized by the fact that magnetic metal grains are covered with ceramic above 20 volume %. Further, a method of manufacturing the electromagnetic absorber and the composite member is characterized by the fact that composite magnetic particles, in which a plurality of magnetic metal grains and ceramic are unified, are formed through a mechanical alloying method applied to a composite powder composed of magnetic metal powder and ceramic powder. The electromagnetic wave absorber can be used in a semiconductor device, an optical sending module, an optical receiving module, an optical sending and receiving module, an automatic tollgate in which erroneous operation due to electromagnetic wave disturbance is provided by use of the electromagnetic wave absorber.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: July 19, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Tadashi Fujieda, Shinzou Ikeda, Sai Ogawa, Teruyoshi Abe, Yasuhisa Aono
  • Publication number: 20050140539
    Abstract: An electromagnetic wave absorber for use in the high frequency range above 1 Ghz and a composite member are characterized by the fact that magnetic metal grains are covered with ceramic above 20 volume %. Further, a method of manufacturing the electromagnetic absorber and the composite member is characterized by the fact that composite magnetic particles, in which a plurality of magnetic metal grains and ceramic are unified, are formed through a mechanical alloying method applied to a composite powder composed of magnetic metal powder and ceramic powder. The electromagnetic wave absorber can be used in a semiconductor device, an optical sending module, an optical receiving module, an optical sending and receiving module, an automatic tollgate in which erroneous operation due to electromagnetic wave disturbance is provided by use of the electromagnetic wave absorber.
    Type: Application
    Filed: February 28, 2005
    Publication date: June 30, 2005
    Inventors: Tadashi Fujieda, Shinzou Ikeda, Sai Ogawa, Teruyoshi Abe, Yasuhisa Aono
  • Patent number: 6909185
    Abstract: A composite material is provided, which has a low thermal expansivity, a high thermal conductivity, and a good plastic workability, which composite material may be applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than the metal. It is characterized in that the inorganic particles are dispersed in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joined together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10?6 to 14×10?6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: June 21, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Publication number: 20050093390
    Abstract: A rotor has magnets segmented in a circumferential direction of a periphery of a shaft, wherein magnetizing directions of the segmented magnets continuously vary, and a non-magnetic material or a ferromagnetic material is interposed in a circumferential gap between the segmented magnets. Further, a method of manufacturing a rotor comprises steps of arranging coils so that a longitudinal direction of each of the coils is along an axis of the shaft and magnetizing the segmented magnets. Still further, a rotary machine uses the rotor.
    Type: Application
    Filed: December 6, 2004
    Publication date: May 5, 2005
    Inventors: Matahiro Komuro, Masashi Kitamura, Junya Kaneda, Motoya Ito, Teruyoshi Abe, Yoshihiko Kuriyama
  • Patent number: 6833617
    Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than said metal. It is characterized in that said inorganic particles disperse in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joining together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10−6 to 14×10−6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: December 21, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Publication number: 20040154703
    Abstract: A high strength Mg based alloy and a Mg based casting alloy having a good fluidity and a good mechanical property, and are used to provide a molded article using the alloy. A high strength Mg based alloy, which contains 12 to 20% of Al by weight; 0.1 to 10% of Zn; 0.1 to 15% of Sn; and 0.05 to 1.5% of Mn is used by being injection molded.
    Type: Application
    Filed: December 31, 2003
    Publication date: August 12, 2004
    Inventors: Kiyomi Nakamura, Teruo Hirane, Toshio Uchida, Teruyoshi Abe
  • Patent number: 6755922
    Abstract: An object of the present invention is to provide a high strength Mg based alloy and a Mg based casting alloy having a good fluidity and a good mechanical property, and a molded article using the alloy. A high strength Mg based alloy, which contains, by weight, 12 to 20% of Al, 0.1 to 10% of Zn; 0.1 to 15% of Sn; and 0.05 to 1.5% of Mn.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: June 29, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Kiyomi Nakamura, Teruo Hirane, Toshio Uchida, Teruyoshi Abe
  • Publication number: 20040031545
    Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied.
    Type: Application
    Filed: August 20, 2003
    Publication date: February 19, 2004
    Inventors: Kazutaka Okamoto, Yasuo Kondo, Teruyoshi Abe, Yasuhisa Aono, Junya Kaneda, Ryuichi Saito, Yoshihiko Koike
  • Patent number: 6646344
    Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: November 11, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Kazutaka Okamoto, Yasuo Kondo, Teruyoshi Abe, Yasuhisa Aono, Junya Kaneda, Ryuichi Saito, Yoshihiko Koike
  • Publication number: 20030190498
    Abstract: An object of the present invention is to provide an electromagnetic wave absorber which is excellent in the electromagnetic wave absorbing characteristics in the high frequency range above 1 GHz, and to provide a method of manufacturing the electromagnetic wave absorber and appliances using the electromagnetic wave absorber.
    Type: Application
    Filed: April 9, 2001
    Publication date: October 9, 2003
    Inventors: Tadashi Fujieda, Shinzou Ikeda, Sai Ogawa, Teruyoshi Abe, Yasuhisa Aono
  • Patent number: 6630734
    Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: October 7, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Kazutaka Okamoto, Yasuo Kondo, Teruyoshi Abe, Yasuhisa Aono, Junya Kaneda, Ryuichi Saito, Yoshihiko Koike