Patents by Inventor Teruyoshi Hamagawa

Teruyoshi Hamagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDERING PASTE FLUX AND SOLDERING PASTE
    Publication number: 20140083567
    Abstract: The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.
    Type: Application
    Filed: October 7, 2011
    Publication date: March 27, 2014
    Applicant: HARIMA CHEMICALS, INC.
    Inventors: Teruyoshi Hamagawa, Youichi Kukimoto, Taku Hasegawa, Hitoshi Sakurai