Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the previous temperature to connect the lead terminal to the second solder section by fusion bonding.

Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the temperature in step (d) to connect the lead terminal to the second solder section by fusion bonding.

Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the temperature in step (d) to connect the lead terminal to the second solder section by fusion bonding.

Abstract: A high-frequency composite material, having soft magnetic and dielectric characteristics, comprising a soft magnetic alloy powder represented by the general composition A.sub.a M.sub.b D.sub.c and a synthetic resin, wherein A represents at least one element or mixture thereof selected from the group consisting of Fe, Co and Ni; M represents at least one element or mixture thereof selected from the group consisting of Hf, Zr, W, Ti, V, Nb, Mo, Cr, Mg, Mn, Al, Si, Ca, Sr, Ba, Cu, Ga, Ge, As, Se, Zn, Cd, In, Sn, Sb, Te, Pb, Bi and rare earth elements; D represents at least one element or mixture thereof selected from the group consisting of O, C, N and B; and the suffixes a, b, and c in the general formula A.sub.a M.sub.b D.sub.c satisfy the following equations represented by atomic percent: 40.ltoreq.a<80, 0.ltoreq.b.ltoreq.30, and 0<c.ltoreq.50.