Abstract: The film coating device forms a film of a coating liquid on the surface of a material to be coated using an inkjet printer. A print head unit moves in a first direction with respect to a surface of a material to be coated, and a plurality of print heads are continuously mounted on the print head unit over an entire coating width in a direction or orthogonal to a first direction. A fixed control unit is provided on a fixed portion of the film coating device, and a coating control unit is provided on the moving portion of the film coating device. The coating control unit is configured to control a coating state of the plurality print heads and moves together with the print head unit. The coating control unit is connected to the fixed control unit by a transmission line.

Abstract: An ink-jet type print head discharge inspecting apparatus comprises an inspecting area in which an anomaly in an ink-jet nozzle is inspected according to an impacted droplet pattern of an oriented film material discharged using the ink-jet nozzle, a film forming area in which an oriented film is formed by discharging and impacting the oriented film material using the ink-jet nozzle, and a moving means configured to move the ink-jet nozzle from the inspecting area to the film forming area, or move a position of the inspecting area and a position of the film forming area to a position opposing the ink-jet nozzle, when the impacted droplet pattern is within a predetermined range.

Abstract: There are provided n number of line-type inkjet nozzles (2) which include nozzles (4) that eject a liquid material and are arranged in a row, and which are arranged in parallel with each other so that positions of the nozzles (4) are shifted from each other by 1/n of a nozzle pitch (P1). Thus, an inkjet head (1) as a whole has a state equivalent to a state in which the nozzles (4) are arranged at 1/n of a nozzle pitch of one line-type inkjet nozzle (2). The inkjet head (1) is capable of adjusting a timing of ejecting the liquid material for each line-type inkjet nozzle (2). Accordingly, adjustment of a dot pitch such as fine coating and rough coating can be performed with ease.

Abstract: When liquid materials are fed to inkjet heads, fluid pressures are equalized so that a gas does not remain in liquid feed pipe lines. Separate liquid feed pipe lines (3) for feeding the liquid material, each of which communicates with each of a plurality of inkjet heads (4), are each connected to a common liquid feed pipe line (2) which stores one kind of the liquid material and communicates with an ink tank (1). Separate gas flow pipe lines (19), each of which is capable of feeding a gas and communicates with a connection portion between the common liquid feed pipe line (2) and each of the separate liquid feed pipe lines (3), with each of the inkjet heads (4), or with both the connection portion and each of the inkjet heads (4), are each connected to a bypass pipe line (18a).

Abstract: A discharge rate control method for an ink-jet printer (1) includes forming a film (B) on a coating article (2) having a non ink-absorbent characteristic. Ink is discharged on coating article (2) from a plurality of nozzles (4) of a print head (3). The film thickness of film (B) is measured, corresponding to ink discharge positions of each nozzle (4). The discharge rate of ink is corrected for each nozzle (4) by increasing or decreasing the discharge rate based on differences between a target film thickness (Ba) and a film thickness at an ink discharge position of each nozzle (4).

Abstract: In drying of a glass substrate to which a coated film is applied, the heating and drying is conducted while feeding means 10, 18, which always moves on a lower surface of the glass substrate 6 to which the coated film is applied, abuts against the substrate, in order to solve a problem that when the lower surface of the coated film is supported for a long time, supporting traces occur and thereby quality of the glass substrate is reduced. With this configuration, traces of the pin 11, 12, 21 are less likely to occur.

Abstract: Discharge rate control method for ink-jet printer 1 including film forming step forming film B on coating article 2 with non ink-absorbent characteristic by discharging ink on coating article 2 from a plurality of nozzles 4 of print head 3, film thickness measuring step measuring film thickness of film B, corresponding to ink discharge position of each nozzle 4, formed on coating article 2 in film forming step, and discharge rate correcting step correcting discharge rate of ink from each nozzle 4 by increasing or decreasing discharge rate based on difference between target film thickness Ba and film thickness at ink discharge position of each nozzle 4 measured in film thickness measuring step.

Abstract: When liquid materials are fed to inkjet heads, fluid pressures of liquid materials to be fed to inkjet heads are equalized so that a gas does not remain in liquid feed pipe lines without causing structures of the liquid feed pipe lines to be complicated. Separate liquid feed pipe lines (3) for feeding the liquid material, each of which communicates with each of a plurality of inkjet heads (4), are each connected to a common liquid feed pipe line (2) which stores one kind of the liquid material and communicates with an ink tank (1). Separate gas flow pipe lines (19), each of which is capable of feeding a gas and communicates with a connection portion between the common liquid feed pipe line (2) and each of the separate liquid feed pipe lines (3), with each of the inkjet heads (4), or with both the connection portion and each of the inkjet heads (4), are each connected to a bypass pipe line (18a) (common gas flow pipe line (18)) capable of being opened and closed with respect to the atmosphere.

Abstract: When liquid materials are fed to inkjet heads, fluid pressures of liquid materials to be fed to inkjet heads are equalized so that a gas does not remain in liquid feed pipe lines without causing structures of the liquid feed pipe lines to be complicated. Separate liquid feed pipe lines (3) for feeding the liquid material, each of which communicates with each of a plurality of inkjet heads (4), are each connected to a common liquid feed pipe line (2) which stores one kind of the liquid material and communicates with an ink tank (1). Separate gas flow pipe lines (19), each of which is capable of feeding a gas and communicates with a connection portion between the common liquid feed pipe line (2) and each of the separate liquid feed pipe lines (3), with each of the inkjet heads (4), or with both the connection portion and each of the inkjet heads (4), are each connected to a bypass pipe line (18a) (common gas flow pipe line (18)) capable of being opened and closed with respect to the atmosphere.

Abstract: In drying of a glass substrate to which a coated film is applied, the heating and drying is conducted while feeding means 10, 18, which always moves on a lower surface of the glass substrate 6 to which the coated film is applied, abuts against the substrate, in order to solve a problem that when the lower surface of the coated film is supported for a long time, supporting traces occur and thereby quality of the glass substrate is reduced. With this configuration, traces of the pin 11, 12, 21 are less likely to occur.

Abstract: When liquid materials are fed to inkjet heads, fluid pressures of liquid materials to be fed to inkjet heads are equalized so that a gas does not remain in liquid feed pipe lines without causing structures of the liquid feed pipe lines to be complicated. Separate liquid feed pipe lines (3) for feeding the liquid material, each of which communicates with each of a plurality of inkjet heads (4), are each connected to a common liquid feed pipe line (2) which stores one kind of the liquid material and communicates with an ink tank (1). Separate gas flow pipe lines (19), each of which is capable of feeding a gas and communicates with a connection portion between the common liquid feed pipe line (2) and each of the separate liquid feed pipe lines (3), with each of the inkjet heads (4), or with both the connection portion and each of the inkjet heads (4), are each connected to a bypass pipe line (18a) (common gas flow pipe line (18)) capable of being opened and closed with respect to the atmosphere.

Abstract: There are provided n number of line-type inkjet nozzles (2) which include nozzles (4) that eject a liquid material and a rearranged in a row, and which are arranged in parallel with each other so that positions of the nozzles (4) are shifted from each other by 1/n of a nozzle pitch (P1). Thus, an inkjet head (1) as a whole has a state equivalent to a state in which the nozzles (4) are arranged at 1/n of a nozzle pitch of one line-type inkjet nozzle (2). The inkjet head (1) is capable of adjusting a timing of ejecting the liquid material for each line-type inkjet nozzle (2). Accordingly, adjustment of a dot pitch such as fine coating and rough coating can be performed with ease.

Abstract: Discharge rate control method for ink-jet printer 1 including film forming step forming film B on coating article 2 with non ink-absorbent characteristic by discharging ink on coating article 2 from a plurality of nozzles 4 of print head 3, film thickness measuring step measuring film thickness of film B, corresponding to ink discharge position of each nozzle 4, formed on coating article 2 in film forming step, and discharge rate correcting step correcting discharge rate of ink from each nozzle 4 by increasing or decreasing discharge rate based on difference between target film thickness Ba and film thickness at ink discharge position of each nozzle 4 measured in film thickness measuring step.

Abstract: A polishing machine for a peripheral edge of a semiconductor wafer comprises a rotary mechanism 2 which rotates a stack 1 of semiconductor wafers 4 mounted thereon, and a polishing mechanism 3 which is arranged to be movable in the radial direction of the rotary mechanism 2 and polishes the peripheral edges of the rotating semiconductor wafers 4 by means of contactless polishing. Minute gaps s are formed between the rotary column 10 of the polishing mechanism 3 and the stack 1 of semiconductor wafers 4, and polishing solution is drawn into these minute gaps s. The peripheral edges of the semiconductor wafers 4 are polished by means of contactless polishing, using polishing abrasive particles included in polishing solution.

Abstract: The present invention is characterized by an apparatus for carrying extra-thin printed boards, etc., wherein a plurality of rotation axles are oriented in a direction perpendicular to a carrier direction in which the printed boards are to be carried, a plurality of disks are fixed to each of the rotation axles at suitable intervals, each disk having opposed side faces having rims, the disks on adjacent axles in a carrier direction partially overlapping one another in the direction in which the printed boards are to be carried and being free from interference with each other. A plurality of supporting shafts are provided at the rims of right and left side faces of each disk, the supporting shafts on disks on axles which are adjacent to one another overlap one another by a fixed length but not interfering with one another.

Abstract: An etching, developing and peeling apparatus for a printed board includes a vertical disk having a center part fixed with a lower end of a vertical shaft driven and rotated at an elected speed, and a lower face of the disk dotted with nozzles for jetting chemicals in a downward vertical direction.

Abstract: A method of blasting IC frames as electronic components with a suitable apparatus, which prevents the frames from being caught by position restriction means during transfer, and eleiminates necessity for particular operations even if frames of different widths are continuously fed.The blasting is carried out by turning a conveyor belt (8), which has support plate members (11) juxtaposed thereon and has a support groove (D) of an inverted triangular sectional shape formed thereon, jetting slurry onto the IC frames (F) merely placed on the slope surfaces inside the support support groove from a nozzles (2), turning then the frames by a reversion device (3) so as to place them on other slope surfaces, and jetting the slurry from other nozzles.

Abstract: A secondary air introducing device for an engine including a cylinder, an associated piston, and a secondary air introducing hole formed in a side wall of the cylinder in such a manner that said hole is located near the bottom dead center of the piston and is opened and closed by the piston. The secondary air introducing hole is made to communicates through inlet passages with the atmosphere, so that the external air is introduced into the cylinder through the secondary air introducing hole by a negative pressure which is produced in the cylinder at the end of a suction stroke of said engine, and a control valve means opened and closed according to variations in load of the engine is provided in the inlet passages, thus controlling an amount of air introduced therein.

Abstract: The disclosure relates to a compact apparatus which effectively washes holes of printed circuit cards, flushes exfoliation off printed circuit cards and nameplates after etching, degreases and flushes number-plates before painting, and cleans iron, plastic, and glass plates, wherein a processing cistern is divided into a carry-in compartment (A), a cleaning compartment (B), a water-wash finishing compartment (C) and a drying compartment (D), the carry-in compartment (A) comprising an infeed roller, a pair of rubber rollers mounted vertically facing each other at a certain forward position thereof and a cleaning solution shut-out roller rotatable by the lower roller of the pair, the cleaning compartment (B) comprising a pair of rubber rollers vertically facing each other at a certain forward position of the pair of rubber rollers, a cleaning solution shut-out roller rotatable by the lower roller thereof, transfer rollers with conveying belts stretched therebetween so mounted that they may be rotated at the sam

Abstract: A secondary air introducing apparatus for an internal combustion engine comprising a secondary air introducing opening in the sidewall of the cylinder near the position of lower dead point of a piston of the engine. The opening is opened and closed by the piston. A secondary air supply source is interconnected with the opening by an introducing passage. The introducing passage is formed to be an upwardly directed passage extending only upwards from the opening.