Patents by Inventor Teruyuki Watanabe
Teruyuki Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170060357Abstract: A touch panel type operation terminal that is configured to operate in a first operation mode and a second operation mode; and includes a touch panel type display and a control circuit configured to carrying out switching control between the first operation mode and the second operation mode according to simultaneous operations to a plurality of predetermined regions of the touch panel type display.Type: ApplicationFiled: August 30, 2016Publication date: March 2, 2017Inventors: Takafumi Segawa, Teruyuki Watanabe, Isao Magara
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Patent number: 8777198Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: February 16, 2012Date of Patent: July 15, 2014Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Patent number: 8225803Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: GrantFiled: May 4, 2011Date of Patent: July 24, 2012Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
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Publication number: 20120141246Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: ApplicationFiled: February 16, 2012Publication date: June 7, 2012Inventors: Masahiko SEKIMOTO, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Patent number: 8141513Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: January 3, 2011Date of Patent: March 27, 2012Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Publication number: 20110237163Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: June 3, 2011Publication date: September 29, 2011Inventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
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Publication number: 20110203518Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: ApplicationFiled: May 4, 2011Publication date: August 25, 2011Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
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Patent number: 7976362Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: August 3, 2009Date of Patent: July 12, 2011Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
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Patent number: 7959977Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: GrantFiled: April 30, 2010Date of Patent: June 14, 2011Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
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Publication number: 20110094442Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: ApplicationFiled: January 3, 2011Publication date: April 28, 2011Inventors: Masahiko SEKIMOTO, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Patent number: 7886685Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: December 22, 2004Date of Patent: February 15, 2011Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Publication number: 20100221432Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: ApplicationFiled: April 30, 2010Publication date: September 2, 2010Inventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
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Patent number: 7735451Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: GrantFiled: November 14, 2003Date of Patent: June 15, 2010Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
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Patent number: 7735450Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.Type: GrantFiled: March 24, 2008Date of Patent: June 15, 2010Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Teruyuki Watanabe, Ryo Kato, Toshio Yokoyama, Kenichi Suzuki, Kenichi Kobayashi
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Publication number: 20090291624Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: August 3, 2009Publication date: November 26, 2009Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
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Patent number: 7585205Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: October 3, 2007Date of Patent: September 8, 2009Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
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Patent number: 7575636Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.Type: GrantFiled: June 20, 2006Date of Patent: August 18, 2009Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motoshima, Akira Owatari, Naoki Dai
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Publication number: 20090092469Abstract: To provide a substrate processing unit, a substrate transfer method, a substrate cleansing process unit, and a substrate plating apparatus that make it possible for a substrate carry-in mechanism such as a robot arm to quickly release hold on the substrate after carrying in the substrate so as to shorten the time for holding the substrate and improve throughput. The substrate processing unit 10 includes a substrate holding mechanism 10 for holding the substrate 11 in a specified holding position, and a processing mechanism 32 for applying a specified process to the substrate held with the substrate holding mechanism in which a substrate guide mechanism 20 is provided with a guide pin 15 for guiding the substrate to vicinity of a holding position.Type: ApplicationFiled: August 25, 2006Publication date: April 9, 2009Applicant: EBARA CORPORATIONInventors: Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Kenichi Suzuki, Kenichi Kobayashi, Ryo Kato
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Patent number: 7442257Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.Type: GrantFiled: June 20, 2006Date of Patent: October 28, 2008Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motoshima, Akira Owatari, Naoki Dai
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Publication number: 20080178800Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.Type: ApplicationFiled: March 24, 2008Publication date: July 31, 2008Inventors: Seiji Katsuoka, Masahiko Sekimoto, Teruyuki Watanabe, Ryo Kato, Toshio Yokoyama, Kenichi Suzuki, Kenichi Kobayashi