Patents by Inventor Testuo Oyama

Testuo Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4220891
    Abstract: A directly heated cathode for electron tube having a stable electron emission characteristic and a low cut-off voltage is provided. The cathode comprises a base metal of an alloy consisting essentially of 20-30% by weight of tungsten and a trace amount to 0.25% by weight of zirconium, the balance being nickel, binder dots of metallic nickel powders distributed on a flat part at the front side of the base metal, and a layer of thermoelectron emission oxides laid on the flat part at the front side of the base metal. The layer of thermoelectron emission oxides is in direct contact with the flat part through clearances among the binder dots of the metallic nickel powders.
    Type: Grant
    Filed: March 30, 1979
    Date of Patent: September 2, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Hisashi Ando, Ko Soeno, Hiroshi Sakamoto, Testuo Oyama, Takao Kawamura, Hiroshi Fukushima
  • Patent number: 4129801
    Abstract: The present cathode for cathode ray tube of directly heating type is characterized by comprising a cathode substrate body having two leg pieces extended in the same direction and a flat part connected to one end of each leg piece, prepared by shaping a flat metal plate of nickel- or cobalt-based alloy, a bonding layer having an uneven surface prepared by diffusion bonding by heating a powder layer comprising powders of alloy or mixture of nickel and cobalt formed on the flat part, to which a thermionic emission layer is to be bonded, and the thermionic emission layer, and has a very small deformation when used and a longer life.A cathode with much less deformation and much longer life can be obtained by using a cathode substrate body prepared from a flat metal plate provided with a thinner metal layer of at least one of nickel and cobalt on its surface than the flat metal plate by diffusion bonding.
    Type: Grant
    Filed: July 6, 1977
    Date of Patent: December 12, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Ko Soeno, Tomio Iizuka, Toshio Doi, Hisashi Ando, Testuo Oyama, Hiroshi Sakamoto, Akira Misumi