Patents by Inventor Tesuo Uwaji

Tesuo Uwaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5932066
    Abstract: According to a film removing device, a film-coated resin molded material having a film coated on one surface of a matrix resin is flattened by a flattening roll in a heating chamber. Further, the film-coated resin molded material is fed between a peeling roll and a feeding roll of roll type rolling means for rolling and stretching. The velocity of a peeling surface of the peeling roll is made relatively higher than the velocity of a feeding surface of the feeding roll, whereby a difference in elongation between the matrix resin and the film, and a shearing force are produced to peel the film. An applicator type supply device supplies a liquid as frictional force reducing means (e.g. water) to the peeling surface and the feeding surface. Thus, a frictional force is reduced, and stretching accompanying rolling fully works. Consequently, the film becomes easy to fracture and peel, and its peeling can be performed effectively.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: August 3, 1999
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Tesuo Uwaji, Naokazu Takeuchi, Yuji Inagaki, Toru Ikeya