Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic wave reflecting material layer, if needed, (B) a supporting layer, (C) a resin layer, if needed, (D) a supporting layer, and (E) a metallic pattern layer prepared by arranging at least one of a pattern unit comprising a geometrical pattern formed by use of a continuous metallic band, or comprising a multi-figured structure formed by combining a plurality of band-shaped metallic figures so as not to contact with each other; and an electromagnetic wave reflection-preventing method by use of the electromagnetic wave reflection-preventing material.

Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic have reflecting metallic material layer, if needed, (B) a substrate layer, (C) a resin layer containing a powder of at least one selected from ferrite, carbon, metal powder and an electrically conductive metallic oxide, and, if needed, a good dielectric material, if needed, (D) a supporting film layer, and (E) a pattern coating layer prepared in the form of a geometrical pattern, containing a metal powder and having a volume resistivity of 10.sup.-3 to 10.sup.10 .OMEGA..multidot.

Abstract: An electromagnetic wave reflection-preventing material having a structure formed by a process which comprises successively laminating (A) a pattern layer formed in the form of a geometrical pattern having a volume resistivity of 10.sup.3 .OMEGA. .

Abstract: A photopolymerizable composition comprising:(a) an aromatic epoxy resin derivative containing, per kilogram of the resin, 0.3 to 10 mole equivalents of a polymerizable unsaturated group and 0.1 to 3 mole equivalents of a specific aprotic onium salt-containing group,(b) a polysiloxane having a specific polysiloxane chain in a molecule, and containing 0.01 to 5 mole equivalents, per kilogram of the polysiloxane, of the aprotic onium salt-containing group, and(c) a photopolymerization initiator.Said photopolymerizable composition can form a resist film excellent in adhesion to a substrate, heat resistance, chemical resistance, impact resistance and solder plating property, and is suitable as a solder resist in particular.

Abstract: Disclosed is a coating composition for metals containing (A) a modified bisphenol type epoxy resin and (b) a phenol resin and/or an amino resin, which composition has excellent properties in fabricating properties, corrosion resistance, etc. and is suitably applicable to both inner and outer surfaces of the vessels for use in food and drink.