Abstract: A microwave plasma processing apparatus has a process chamber in which an object to be processed is subjected to plasma processing under a predetermined negative pressure environment. A susceptor holding the object thereon is provided in the process chamber. The susceptor is moved by a susceptor moving member which is moved by a susceptor moving mechanism located outside the process chamber. The susceptor moving member extends from the process chamber via a bellows provided to a bottom of the process chamber. The bellows allows a vertical movement of the susceptor moving member while providing a hermetic seal to the process chamber to maintain the predetermined negative pressure environment in the process chamber. A vacuum pump is provided to the bottom of the process chamber so that an inlet opening of the vacuum pump aligns with the susceptor in the vertical direction.

Abstract: A substrate transfer apparatus (20) transfers a substrate between a first substrate support member (21) for supporting a plurality of substrates and a second substrate support member (15).

Abstract: The present invention provides a transfer apparatus and a transfer method capable of reducing the time required for transferring a plurality of to-be-transferred objects, and a treatment apparatus and a treatment method capable of increasing the throughput. The transfer apparatus, wherein the objects are transferred from a first support unit supporting the objects to a second support unit capable of supporting the objects, comprising load/unload means for unloading the objects one by one from the first support unit in a first position in which the objects can be carried out of the first support unit, and loading the objects into the second support unit one by one in a second position in which the objects can be carried into the second support unit, a third support unit for permitting loading and unloading of the objects by the load/unload means, the third support unit being capable of supporting the objects, and transfer means for moving the load/unload means from the first position to the second position.

Abstract: According to the invention, there is provided a substrate transferring apparatus for transferring substrates from a substrate transport container containing a plurality of substrates to be treated to a substrate holder for holding a plurality of substrates to be treated or vice versa, the apparatus including arms for supporting substrate, a supporting member for supporting the arms, and a drive arrangement for driving the supporting member to operate. Each of the arms include a plate shaped arm main body having a connecting section for connecting the arm to the drive arrangement, supporting sections having a thickness greater than that of the arm main body for supporting corresponding peripheral areas of the substrate, and stoppers having a thickness greater than that of the supporting sections for abutting lateral sides of the substrate to rigidly hold the substrate.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A load-lock unit is disposed between first and second atmospheres, stores a wafer transferred from the first atmosphere, is blocked off from the first atmosphere, is thereafter set in the same atmosphere as or a similar atmosphere to the second atmosphere, and is opened to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a storing device, disposed in the load-lock chamber, for storing a plurality of wafers vertically at a gap, a holding mechanism for holding one of the plurality of wafers stored in the storing device, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting device for detecting the positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.