Abstract: A control method includes: (a) connecting a power supply to an electrode of an electrostatic chuck inside a chamber and applying a voltage from the power supply to the electrode; (b) after (a), switching a connection between the electrode and the power supply to a non-connection state; (c) after (b), supplying a gas into the chamber to generate plasma; and (d) measuring a potential of the electrode during (c).

Abstract: A discharging method of removing electric charge from a substrate is provided. In the discharging method, gas is supplied into a processing chamber while the substrate is placed on an electrostatic chuck provided in the processing chamber, and direct-current (DC) voltage is applied to an attracting electrode of the electrostatic chuck, until discharge occurs in the processing chamber. After the discharge occurs, the DC voltage is adjusted to a magnitude in which an amount of charge on the substrate becomes zero or becomes in a neighborhood of zero, and the substrate is removed from the electrostatic chuck.

Abstract: In a measurement method, a terminal is brought into contact with an electrode in an electrostatic chuck in contact with a substrate that is grounded. Further, the terminal, the electrostatic chuck and the substrate are fixed, and a current value and a voltage value are measured using an ammeter and a voltmeter, respectively, that are connected to the terminal. In addition, whether or not the terminal and the electrode are electrically connected is determined from a slope of the current value and/or a peak current value based on the measured current value and the voltage value.

Abstract: A control method includes: (a) connecting a power supply to an electrode of an electrostatic chuck inside a chamber and applying a voltage from the power supply to the electrode; (b) after (a), switching a connection between the electrode and the power supply to a non-connection state; (c) after (b), supplying a gas into the chamber to generate plasma; and (d) measuring a potential of the electrode during (c).

Abstract: A discharging method of removing electric charge from a substrate is provided. In the discharging method, gas is supplied into a processing chamber while the substrate is placed on an electrostatic chuck provided in the processing chamber, and direct-current (DC) voltage is applied to an attracting electrode of the electrostatic chuck, until discharge occurs in the processing chamber. After the discharge occurs, the DC voltage is adjusted to a magnitude in which an amount of charge on the substrate becomes zero or becomes in a neighborhood of zero, and the substrate is removed from the electrostatic chuck.

Abstract: A measuring device includes a switch that switches a connection of an electrode to which a direct current voltage is applied, wherein the electrode is within an electrostatic chuck disposed in a plasma processing device; a component provided with electrostatic capacitance, wherein the component is connected to the switch; and a measuring unit that measures a value corresponding to an electric charge amount accumulated in the component provided with the electrostatic capacitance.

Abstract: In a measurement method, a terminal is brought into contact with an electrode in an electrostatic chuck in contact with a substrate that is grounded. Further, the terminal, the electrostatic chuck and the substrate are fixed, and a current value and a voltage value are measured using an ammeter and a voltmeter, respectively, that are connected to the terminal. In addition, whether or not the terminal and the electrode are electrically connected is determined from a slope of the current value and/or a peak current value based on the measured current value and the voltage value.

Abstract: A measuring device includes a switch that switches a connection of an electrode to which a direct current voltage is applied, wherein the electrode is within an electrostatic chuck disposed in a plasma processing device; a component provided with electrostatic capacitance, wherein the component is connected to the switch; and a measuring unit that measures a value corresponding to an electric charge amount accumulated in the component provided with the electrostatic capacitance.

Abstract: An abnormality detecting unit includes a monitoring unit for monitoring an operation from a wafer deviation starting point to a transfer gate valve opening point after performing a plasma process on the wafer and specifying the operation as a wafer deviation operation; an acquisition unit for acquiring a high frequency signal of at least one of a progressive wave and a reflection wave outputted from a directional coupler between a high frequency power supply for applying a high frequency power into a processing chamber and a matching unit or between a lower electrode as a mounting table for mounting thereon the wafer and the matching unit during the wafer deviation operation; an analysis unit for analyzing a waveform pattern of the high frequency signal; and an abnormality determination unit for determining whether there is an abnormal electric discharge based on an analysis result of the waveform pattern.