Patents by Inventor Tetsuaki Aoki

Tetsuaki Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090314448
    Abstract: A method for producing a metal material involves applying, to the surface of the ZAS alloy, an agent comprising a solvent and, dispersed therein, a material containing Cu such as Cu powder and a Cu—Mn alloy powder and preferably, dispersed or dissolved therein, a reducing agent capable of reducing an oxide film present on the surface of the ZAS alloy, and heating the ZAS alloy having the agent applied thereon, to thereby diffuse Cu into the alloy. The metal material comprises a Zn—Al—Sn based alloy (ZAS alloy) and Cu diffused in the alloy, wherein Cu is diffused into the inside of the alloy to a depth from the surface of 0.5 mm or more, the concentration of Cu decreases from the surface of the ZAS alloy towards the inside thereof, and there is present no specific interface between Cu and the ZAS alloy.
    Type: Application
    Filed: August 26, 2009
    Publication date: December 24, 2009
    Inventors: Mitsuo Kuwabara, Tadashi Okada, Naoji Yamamoto, Masahito Hasuike, Michiharu Hasegawa, Tetsuaki Aoki, Masanori Kogawa, Kazunori Sakamoto, Keizou Tanoue
  • Patent number: 7601389
    Abstract: A metal material comprises a Zn—Al—Sn based alloy (ZAS alloy) and Cu diffused in the alloy, wherein Cu is diffused into the inside of the alloy to a depth from the surface of 0.5 mm or more, the concentration of Cu decreases from the surface of the ZAS alloy towards the inside thereof, and there is present no specific interface between Cu and the ZAS alloy; and a method for producing the metal material involves applying, to the surface of the ZAS alloy, an agent comprising a solvent and, dispersed therein, a material containing Cu such as a Cu powder and a Cu—Mn alloy powder and preferably, dispersed or dissolved therein, a reducing agent capable of reducing an oxide film present on the surface of the ZAS alloy, and heating the ZAS alloy having the agent applied thereon, to thereby diffuse Cu into the alloy.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: October 13, 2009
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Mitsuo Kuwabara, Tadashi Okada, Naoji Yamamoto, Masahito Hasuike, Hideo Yoshikawa, Michiharu Hasegawa, Tetsuaki Aoki, Masanori Kogawa, Kazunori Sakamoto, Keizou Tanoue
  • Publication number: 20060134453
    Abstract: A metal material comprises a Zn—Al—Sn based alloy (ZAS alloy) and Cu diffused in the alloy, wherein Cu is diffused into the inside of the alloy to a depth from the surface of 0.5 mm or more, the concentration of Cu decreases from from the surface of the ZAS alloy towards the inside thereof, and there is present no specific interface between Cu and the ZAS alloy; and a method for producing the metal material involves applying, to the surface of the ZAS alloy, an agent comprising a solvent and, dispersed therein, a material containing Cu such as a Cu powder and a Cu—Mn alloy powder and preferably, dispersed or dissolved therein, a reducing agent capable of reducing an oxide film present on the surface of the ZAS alloy, and heating the ZAS alloy having the agent applied thereon, to thereby diffuse Cu into the alloy.
    Type: Application
    Filed: July 31, 2003
    Publication date: June 22, 2006
    Applicant: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Mitsuo Kuwabara, Tadashi Okada, Naoji Yamamoto, Masahito Hasuike, Hideo Yoshikawa, Michiharu Hasegawa, Tetsuaki Aoki, Masanori Kogawa, Kazunori Sakamoto, Keizou Tanoue