Patents by Inventor Tetsufumi Yoshida

Tetsufumi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250138243
    Abstract: The present invention provides an optical multiplexer that can be downsized and includes a directional coupler capable of being fabricated with stable quality and accuracy. The present invention further provides an image projector including the optical multiplexer. The optical multiplexer includes: input waveguides for respectively receiving a plurality of visible light beams of different wavelengths; a directional coupler for multiplexing the plurality of visible light beams; and an output waveguide for outputting the multiplexed light. At least one of the input waveguides connected to the directional coupler and the output waveguide have a tapered structure. Therefore, the optical multiplexer can be downsized by reducing its overall length and can be fabricated with stable quality and accuracy by reducing a decrease in multiplexing efficiency caused by an error in the width of an optical coupling waveguide.
    Type: Application
    Filed: January 12, 2023
    Publication date: May 1, 2025
    Inventors: Yuuta Yabe, Akira HIMENO, Koichi HORII, Osamu KAWASAKI, Kazuki IWABATA, Yojiro KAMEI, Tetsufumi YOSHIDA
  • Patent number: 8387494
    Abstract: An object of the present invention is to provide a punching method using a punch, which makes it possible to effectively improve the durability of a tooth portion of the punch. In a punching method using a punch for forming a through-hole in a workpiece by punching the workpiece using a punch, at least a tooth portion of the punch is made substantially solid when the workpiece is punched by the punch, and the tooth portion is made substantially hollow, thereby a diameter of the tooth portion is reduced by a reaction force received from the workpiece, when the workpiece is separated from the punch after the punching of the workpiece.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: March 5, 2013
    Assignees: Musashi Seimitsu Industry Co., Ltd., Nichidai Corporation
    Inventors: Shinichi Murata, Tetsufumi Yoshida
  • Publication number: 20090229432
    Abstract: An object of the present invention is to provide a punching method using a punch, which makes it possible to effectively improve the durability of a tooth portion of the punch. In a punching method using a punch for forming a through-hole in a workpiece by punching the workpiece using a punch, at least a tooth portion of the punch is made substantially solid when the workpiece is punched by the punch, and the tooth portion is made substantially hollow, thereby a diameter of the tooth portion is reduced by a reaction force received from the workpiece, when the workpiece is separated from the punch after the punching of the workpiece.
    Type: Application
    Filed: March 10, 2009
    Publication date: September 17, 2009
    Applicants: Musashi Seimitsu Industry Co., Ltd., Nichidai Corporation
    Inventors: Shinichi Murata, Tetsufumi Yoshida