Patents by Inventor Tetsuharu Mizutani

Tetsuharu Mizutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering method
    Patent number: 7490403
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: February 17, 2009
    Assignees: NEC Infrontia Corporation, NEC Toppan Circuit Solutions Toyoma, Inc., Soldercoat Co., Ltd., Maruya Seisakusbo Co., Ltd., Nihon Den-netsu Keiki Co., Ltd.
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method
    Publication number: 20070107214
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Application
    Filed: December 5, 2006
    Publication date: May 17, 2007
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method and solder joint member
    Patent number: 7176388
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: February 13, 2007
    Assignees: NEC Infrontia Corporation, NEC Toppan Circuit Solutions Toyama, Inc., Soldercoat Co., Ltd., Maruya Seisakusho Co. Ltd., Nihon Den-netsu Keiki Co., Ltd.
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method and solder joint member
    Patent number: 6902102
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: June 7, 2005
    Assignees: NEC Infrontia Corporation, NEC Toppan Circuit Solutions Toyama, Inc., Soldercoast Co., Ltd., Maruya Seisakusho Co., Ltd., Nihon Den-netsu Keiki Co., Ltd.
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method and solder joint member
    Publication number: 20050067189
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Application
    Filed: November 19, 2004
    Publication date: March 31, 2005
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method and solder joint member
    Publication number: 20030168499
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Application
    Filed: January 10, 2003
    Publication date: September 11, 2003
    Applicant: NEC Infrontia Corporation
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka