Patents by Inventor Tetsuharu Urawa

Tetsuharu Urawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having stacked semiconductor chips sealed with a resin seal member
    Patent number: 7199469
    Abstract: The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: April 3, 2007
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Toru Ishida, Tetsuharu Urawa, Fujio Ito, Tomoo Matsuzawa, Kazunari Suzuki, Akihiko Kameoka, Hiromichi Suzuki, Takuji Ide
  • Semiconductor device
    Publication number: 20020043717
    Abstract: The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 18, 2002
    Inventors: Toru Ishida, Tetsuharu Urawa, Fujio Ito, Tomoo Matsuzawa, Kazunari Suzuki, Akihiko Kameoka, Hiromichi Suzuki, Takuji Ide