Abstract: A phosphor, an optical fiber plate containing lead particles, a CCD, and an X-ray shielding member consisting of copper tungsten are sequentially stacked on a substrate from an X-ray incident surface side and sealed in a container made of a light-shielding synthetic resin. The substrate has projecting portions projecting toward the direction of X-ray incident along three sides of the X-ray incident surface. Each of these projecting portions has an overhang portion projecting toward the optical fiber plate. The overhang portions are close to or in contact with corresponding side surfaces of the optical fiber plate so that the optical fiber plate is fixed at a predetermined position. The container has, in the inner surface, convex portions corresponding to the projecting portions, so the substrate is fixed in the container.

Abstract: An X-ray detecting element detects an image produced by X-ray irradiation. An apparatus case capable of being inserted into a mouth has an X-ray irradiation face having different dimensions in two directions perpendicular to each other, and houses the X-ray detecting element. A cable is connected to the apparatus case to transmit a signal from the X-ray detecting element to the outside of the apparatus case. The cable is drawn out from the apparatus case in a direction which is parallel with the X-ray irradiation face and perpendicular to the longitudinal direction of the X-ray irradiation face. According to this configuration, the cable does not obstruct the imaging operation in a course of imaging teeth in a mouth, particularly a molar portion. Therefore, an imaging operation can be easily conducted without giving the subject an unpleasant feeling.

Abstract: The solid state image sensor comprises a chip in a package. A image sensor is formed in the chip. The package has a package main body, a light receiving glass plate fixed to the package main body, and a buffer member arranged between the package main body and light receiving glass plate. The buffer member is fixed to the light receiving glass plate and to the package main body. The thermal expansion coefficient of the buffer member is substantially equal to that of the light receiving glass plate, so that the light receiving plate is fixed to the package main body even though the temperature of the imaging device changes. Therefore, the adhesion between the package main body and the light receiving glass plate and the airtightness in the package are maintained.