Patents by Inventor Tetsuhiko Sambei

Tetsuhiko Sambei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6944377
    Abstract: It is an object of the invention to supply an optical communication device and an optical communication module that are provided with a substrate, a vertical waveguide that is formed in the substrate and that is for transmitting light in a thickness direction of the substrate, a horizontal waveguide that is formed in the substrate and that is for transmitting light in a planar direction of the substrate, and a light bending portion for optically coupling the vertical waveguide and the horizontal waveguide. The substrate is a laminated body including a first substrate in whose surface a groove is formed and in which a reflective mirror is disposed on at least one end of the groove, and a second substrate layered to the surface of the first substrate in which the groove is formed and in which a through hole located in opposition to the portion of the groove in which the reflective mirror is disposed is formed.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: September 13, 2005
    Assignee: Hitachi Maxell, Ltd.
    Inventors: Nobuhiro Umebayshi, Hideo Daimon, Tetsuhiko Sambei, Akito Sakemoto
  • Publication number: 20050180681
    Abstract: It is an object of the invention to supply an optical communication device and an optical communication module that are provided with a substrate, a vertical waveguide that is formed in the substrate and that is for transmitting light in a thickness direction of the substrate, a horizontal waveguide that is formed in the substrate and that is for transmitting light in a planar direction of the substrate, and a light bending portion for optically coupling the vertical waveguide and the horizontal waveguide. The substrate is a laminated body including a first substrate in whose surface a groove is formed and in which a reflective mirror is disposed on at least one end of the groove, and a second substrate layered to the surface of the first substrate in which the groove is formed and in which a through hole located in opposition to the portion of the groove in which the reflective mirror is disposed is formed.
    Type: Application
    Filed: April 19, 2005
    Publication date: August 18, 2005
    Applicant: Hitachi Maxell, Ltd.
    Inventors: Nobuhiro Umebayshi, Hideo Daimon, Tetsuhiko Sambei, Akito Sakemoto
  • Publication number: 20040091211
    Abstract: It is an object of the invention to supply an optical communication device and an optical communication module that are provided with a substrate, a vertical waveguide that is formed in the substrate and that is for transmitting light in a thickness direction of the substrate, a horizontal waveguide that is formed in the substrate and that is for transmitting light in a planar direction of the substrate, and a light bending portion for optically coupling the vertical waveguide and the horizontal waveguide. The substrate is a laminated body including a first substrate in whose surface a groove is formed and in which a reflective mirror is disposed on at least one end of the groove, and a second substrate layered to the surface of the first substrate in which the groove is formed and in which a through hole located in opposition to the portion of the groove in which the reflective mirror is disposed is formed.
    Type: Application
    Filed: March 10, 2003
    Publication date: May 13, 2004
    Applicant: Hitachi Maxell, Ltd.
    Inventors: Nobuhiro Umebayshi, Hideo Daimon, Tetsuhiko Sambei, Akito Sakemoto
  • Patent number: 5308417
    Abstract: A plasma reactor containing within the processing chamber pieces of magnetic material located to reduce and/or substantially eliminate systematic processing rate nonuniformities. These pieces are placed inside the chamber or attached inside of the pedestal adjacent to the top of the pedestal, where the wafer is to be located for processing. The thickness, shape and magnetic permeabilities of these magnetic pieces are selected to optimize process uniformity.
    Type: Grant
    Filed: September 12, 1991
    Date of Patent: May 3, 1994
    Assignee: Applied Materials, Inc.
    Inventors: David W. Groechel, Masato M. Toshima, Robert J. Steger, Jerry Y. Wong, Tetsuya Ishikawa, Regga Tekeste, Koichi Ito, Tetsuhiko Sambei