Abstract: A rotating shaft housing structure of rotating members, including: a main body; rotating shafts for the rotating members; and a common recess which is provided in the main body, wherein the rotating members are attached to the main body via the respective rotating shafts so as to be rotatable, and the rotating shafts are housed alongside each other in the common recess.

Abstract: In order to provide a digital camera which includes a heat dissipating device which can cool sufficiently a solid state image pick-up device and integrated circuits, which has a high rigidity and which affects little the design of the digital camera, there is provided a digital camera comprising a lens unit 15, a solid state image pick-up device 31 and integrated circuits 41, wherein a camera housing is made to have a double housing construction by an outer housing 11 which is formed of a member having a low thermal conductivity and an inner housing 61 which is formed of a member having a high rigidity and a high thermal conductivity, wherein a heat dissipating space is defined between the outer housing 11 and the inner housing 61, the integrated circuits 41 configuring a heat source and the inner housing 61 are connected together by a member having a high thermal conductivity, and wherein the inner housing 61 is made up of a main body side housing which is situated in the vicinity of the solid state image pi

Abstract: The object is simplification of a manufacturing process for nonvolatile memory by reducing additional processes for forming a charge storage structure, and downsizing of nonvolatile memory.

Abstract: In order to provide a digital camera which includes a heat dissipating device which can cool sufficiently a solid state image pick-up device and integrated circuits, which has a high rigidity and which affects little the design of the digital camera, there is provided a digital camera comprising a lens unit 15, a solid state image pick-up device 31 and integrated circuits 41, wherein a camera housing is made to have a double housing construction by an outer housing 11 which is formed of a member having a low thermal conductivity and an inner housing 61 which is formed of a member having a high rigidity and a high thermal conductivity, wherein a heat dissipating space is defined between the outer housing 11 and the inner housing 61, the integrated circuits 41 configuring a heat source and the inner housing 61 are connected together by a member having a high thermal conductivity, and wherein the inner housing 61 is made up of a main body side housing which is situated in the vicinity of the solid state image pi

Abstract: The object is simplification of a manufacturing process for nonvolatile memory by reducing additional processes for forming a charge storage structure, and downsizing of nonvolatile memory.

Abstract: The object is simplification of a manufacturing process for nonvolatile memory by reducing additional processes for forming a charge storage structure, and downsizing of nonvolatile memory.

Abstract: The object is simplification of a manufacturing process for nonvolatile memory by reducing additional processes for forming a charge storage structure, and downsizing of nonvolatile memory.