Abstract: A composite metal foil is provided comprising a porous metal foil comprising a two-dimensional network structure composed of a metal fiber, and a primer provided on at least a part of the interior and/or periphery of pores of the porous metal foil. According to the present invention, it is possible to obtain a composite metal foil which has a desired function imparted by a primer in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Abstract: A reinforced porous metal foil is provided including a porous portion comprising a two-dimensional network structure composed of a metal fiber and a reinforced portion which is substantially non-porous or less porous than the porous portion. The reinforced portion is composed of the same metal the metal fiber and is continuous and integral with the porous portion. Accordingly, it possible to provide a porous metal foil having superior properties at a low cost in a highly productive manner that is also suitable for continuous production.

Abstract: The porous metal foil of the present invention include a two-dimensional network structure composed of a metal fiber. This porous metal foil has a first side having a higher glossiness, and a second side having a lower glossiness located on the opposite side of the first side. The ratio of glossiness GS of the first side to glossiness GM of the second side, GS/GM, as measured at incident and reflection angles of 60 degrees in accordance with JIS Z 8741 (1997) is from 1 to 15. The present invention provides a highly useful porous metal foil which has a reduced difference in properties between both sides, in addition to the superior properties attributable to a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Abstract: A composite metal foil is provided comprising a porous metal foil comprising a two-dimensional network structure composed of a metal fiber, and a primer provided on at least a part of the interior and/or periphery of pores of the porous metal foil. According to the present invention, it is possible to obtain a composite metal foil which has a desired function imparted by a primer in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Abstract: The porous metal foil of the present invention comprises a two-dimensional network structure composed of a metal fiber. This porous metal foil has a first side having a higher glossiness; and a second side having a lower glossiness located on the opposite side of the first side. The ratio of glossiness GS of the first side to glossiness GM of the second side, GS/GM, as measured at incident and reflection angles of 60 degrees in accordance with JIS Z 8741 (1997) is from 1 to 15. According to the present invention, it is possible to obtain a highly useful porous metal foil which has a reduced difference in properties between the both sides in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Abstract: A reinforced porous metal foil is provided which comprises a porous portion comprising a two-dimensional network structure composed of a metal fiber; and a reinforced portion which is substantially non-porous or less porous than the porous portion, the reinforced portion being composed of the same metal the metal fiber and being continuous and integral with the porous portion. With such features, it possible to obtain a porous metal foil having superior properties at a low cost in a highly productive manner that is also suitable for continuous production.

Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 ?m.

Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

Abstract: Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m2 to 50 mg/m2 and a tin layer having a thickness by weight of 5 mg/m2 to 40 mg/m2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Abstract: It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied.

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.