Patents by Inventor Tetsuichi Inoue

Tetsuichi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6540065
    Abstract: A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: April 1, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Miki Kurabe, Satoshi Sawa, Tetsuichi Inoue
  • Publication number: 20020050443
    Abstract: A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base.
    Type: Application
    Filed: August 1, 2001
    Publication date: May 2, 2002
    Inventors: Miki Kurabe, Satoshi Sawa, Tetsuichi Inoue
  • Patent number: 5089861
    Abstract: The present invention provides a semiconductor laser device which comprises a metallic stem, a cap mounted to one surface of the stem, a mounting block arranged to project from the one surface of the stem into the cap, and a semiconductor laser chip by the mounting block. The stem comprises a first stem member and a second member joined to the first stem member in lamination thereto. The first stem member is formed with a cutting line partially surrounding a portion of the first stem member. The mounting block is provided by bending the partially surrounded portion into the cap to leave a corresponding perforation in the first stem member.
    Type: Grant
    Filed: April 16, 1991
    Date of Patent: February 18, 1992
    Assignee: Rohm Co., Ltd.
    Inventors: Haruo Tanaka, Tetsuichi Inoue