Patents by Inventor Tetsuji Higashino

Tetsuji Higashino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6525160
    Abstract: The present invention provides an epoxy resin composition which comprises an alkoxy-containing silane-modified epoxy resin (A) which is obtainable by dealcoholization condensation reaction between a bisphenol epoxy resin (1) and hydrolyzable alkoxysilane (2); and a curing agent (B) for epoxy resin. The present invention also provides a method for preparing an alkoxy-containing silane-modified epoxy resin, the method comprising dealcoholization condensation reaction between the bisphenol epoxy resin (1) and the hydrolyzable alkoxysilane (2).
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: February 25, 2003
    Assignee: Arakawa Chemical Industries Ltd.
    Inventors: Hideki Goda, Tetsuji Higashino
  • Patent number: 6506868
    Abstract: The present invention provides a partial condensate of glycidyl ether group-containing alkoxysilane which is obtainable by dealcoholization reaction between glycidol and a partial condensate of alkoxysilane, compositions comprising the same and preparation methods thereof. Further, the present invention provides an alkoxy-containing silane-modified polyimide resin, alkoxy-containing silane-modified polyamide-imide resin and alkoxy-containing silane-modified phenol resin which are modified with the partial condensate of glycidyl ether group-containing alkoxysilane, and preparation methods thereof.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: January 14, 2003
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Hideki Goda, Shoji Takeda, Tetsuji Higashino