Abstract: A power-demand-value calculating system includes a storage device and an arithmetic device. The storage device stores data of combinations of temperatures and power result values. The arithmetic device selects data equal to or higher than a predetermined temperature from the storage device and, calculates, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Abstract: A power-demand-value calculating system includes: a storage device configured to store data of combinations of temperatures and power result values; and an arithmetic device configured to: select data equal to or higher than a predetermined temperature from the storage device; and, calculate, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Abstract: A non-transitory computer-readable recording medium stores an ordering program that causes a computer to execute a process. The process includes determining whether an article is a chemical material by using slip issue data that is input when ordering the article; checking whether the slip issue data includes permission identification information indicating that the article has been allowed to be ordered, when the article is determined to be the chemical material; and making an approval request to approve of ordering the article according to a result of the checking of the slip issue data.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A method is disclosed for performing rework soldering for removing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board. The method includes the steps of positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated toward the rework target, the cooling member being situated toward the non-rework target; heating the heating member; and cooling the cooling member.

Abstract: In a case of soldering for mounting a device on a printed circuit board, a printed circuit board to which a device is soldered is heated in a high oxygen concentration atmosphere to form oxide films on surfaces of joints, by which detachment of a device soldered onto the surface of the printed circuit board, positional deviation, and rise from the printed circuit board at the time of reflow of the printed circuit board are prevented.

Abstract: A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.

Abstract: A paste printer allows an electrically-conductive pad formed on a board to be exposed in an opening of a masking member. A removal mechanism is allowed to act on the surface of the electrically-conductive pad within the opening. A rust film is removed from the surface of the electrically-conductive pad. The surface of the electrically-conductive pad gets cleaned. Since the electrically-conductive pad is exposed within the opening of the masking member, the removal mechanism is applied only to the electrically-conductive pad. This results in prevention of damages to the board over an area outside the electrically-conductive pad. In addition, the squeegee serves to supply the electrically-conductive paste to the surface of the electrically-conductive pad through the opening of the masking member. The electrically-conductive pad is covered with the electrically-conductive paste. This results in a reliable prevention of oxidation on the surface of the electrically-conductive pad.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.

Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.

Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.