Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: A heat exchange unit and the method of its manufacture including a base plate with heat dissipating protrusions extending therefrom which are formed by plastic deformation. One or more long holes extend through the base plate to receive heat pipes in conductive contact. The long hole is formed during the extrusion of billets from which the units are formed. Mandrels are placed in the long holes through the billets and the heat exchange unit is formed therefrom. The mandrel is then extracted and replaced by a heat pipe. Further deformation of the base plate around the inserted heat pipe can insure intimate contact for heat conduction between components.

Abstract: Forging equipment and techniques prevent damage to the die set while also preventing abnormal flow of the material used in the forging process. In one embodiment, the forging equipment comprises a die set with a holding portion, constructed separate from the guiding portion. The holding portion is configured to accommodate the workpiece material and the punch portion as it is dropped down on the workpiece. At the comer where the holding portion and the guiding portion meet, the holding portion forms a retaining cavity, which has a sufficient size to accommodate a metal sealing assembly. The metal sealing assembly at one end terminates in an angled material contacting surface that prevents formation of cracks and abnormal flow of material away from its intended path of flow.