Patents by Inventor Tetsuji KATOH

Tetsuji KATOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180148622
    Abstract: A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 ?m to 100 ?m, a filler group (B) having a particle diameter of from 1.0 ?m to smaller than 10 ?m, and a filler group (C) having a particle diameter of from 0.1 ?m to smaller than 1.0 ?m, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.
    Type: Application
    Filed: May 24, 2016
    Publication date: May 31, 2018
    Inventors: Yoshitaka TAKEZAWA, Shihui SONG, Keiji FUKUSHIMA, Tomokazu TANASE, Tetsuji KATOH, Akihiro SANO, Hiroaki KOJIMA