Patents by Inventor Tetsuji Kohara

Tetsuji Kohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
    Patent number: 5910010
    Abstract: A method of manufacturing a semiconductor integrated circuit device includes the steps of constructing a plurality of lead frames having leads which each include an inner portion and an outer portion and electrically connecting a semiconductor chip to the inner portions of the leads of each frame. The lead frames are then stacked one above each other to form a vertical stack and plates are then inserted between each of the lead frames with each plate having an opening in the center whereby a central cavity is formed in the stack. The stack is then placed between a top mold member and a bottom mold member and a resin is injected into the central cavity whereupon the resin is cured to form a single resin package encapsulating the semiconductor chips. The resin package is then released from the mold members.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: June 8, 1999
    Assignees: Hitachi, Ltd., Hitachi ULSI Engineering Corp., Hitachi Tohbu Semiconductor, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Hirotaka Nishizawa, Tomoyoshi Miura, Ichirou Anjou, Masamichi Ishihara, Masahiro Yamamura, Sadao Morita, Takashi Araki, Kiyoshi Inoue, Toshio Sugano, Tetsuji Kohara, Toshio Yamada, Yasushi Sekine, Yoshiaki Anata, Masakatsu Goto, Norihiko Kasai, Shinobu Takeura, Mutsuo Tsukuda, Yasunori Yamaguchi, Jiro Sawada, Hidetoshi Iwai, Seiichiro Tsukui, Tadao Kaji, Noboru Shiozawa