Abstract: Imaging devices and electronic apparatuses incorporating imaging devices are provided. An imaging device as disclosed can include a first pixel of a first pixel and a second pixel of a second pixel. The first and second pixels each have a first electrode, a portion of a photoelectric conversion film, and a portion of a second electrode, where the photoelectric conversion film is between the first electrode and the second electrode. The first electrode of the first pixel has a first area, while the first electrode of the second pixel has a second area that is smaller than the first area. The first pixel can include a light shielding film. Alternatively or in addition, the first pixel can be divided into first and second portions.

Abstract: An apparatus for supplying power to a portable electronic device is disclosed. The apparatus includes a first receptacle to which an AC/DC adaptor is connectable, a second receptacle to which an electronic device is connectable, a battery charger for charging a battery using power supplied by the AC/DC adaptor, an output circuit for supplying power to the electronic device from the AC/DC adaptor when the AC/DC adaptor is connected to the apparatus, and supplies power to the electronic device from the battery when the AC/DC adaptor is not connected to the apparatus, and a control circuit for controlling the battery charger to supply power to the electronic device while charging the battery when the AC/DC adaptor is connected to the apparatus.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: An apparatus for supplying power to a portable electronic device is disclosed. The apparatus includes a first receptacle to which an AC/DC adaptor is connectable, a second receptacle to which an electronic device is connectable, a battery charger for charging a battery using power supplied by the AC/DC adaptor, an output circuit for supplying power to the electronic device from the AC/DC adaptor when the AC/DC adaptor is connected to the apparatus, and supplies power to the electronic device from the battery when the AC/DC adaptor is not connected to the apparatus, and a control circuit for controlling the battery charger to supply power to the electronic device while charging the battery when the AC/DC adaptor is connected to the apparatus.

Abstract: A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.

Abstract: A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.

Abstract: A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.

Abstract: The present invention relates to an amide hydrolase which is with excellent thermostability and stereoselectively hydrolyzes an ?-amino acid amide; a gene encoding the enzyme protein; a novel recombinant vector containing the gene; a transformant containing the recombinant vector; and a process for producing an L-?-amino acid using the transformant.

Abstract: The present invention provides: a protein having an improved nitrile hydratase activity, whereby heat resistance has been improved when compared with a wild-type nitrile hydratase activity, wherein the amino acid sequence of a nitrile hydratase is modified; a gene DNA encoding the above protein; a recombinant vector having the above gene DNA; a transformant or transductant having the above recombinant vector; a nitrile hydratase collected from a culture of the above transformant or transductant, and a production method thereof; and a method for producing an amide compound.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides a modified ethylenediamine-N,N?-disuccinate:ethylenediamine lyase. The present invention also provides a protein that comprises the amino acid sequence represented by SEQ ID NO: 1; or a protein that comprises an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 1 by deletion, substitution, or addition of one or more amino acid residues, and has an ethylenediamine-N,N?-disuccinate:ethylenediamine lyase activity.

Abstract: The present invention provides: a protein having an improved nitrile hydratase activity, whereby heat resistance has been improved when compared with a wild-type nitrile hydratase activity, wherein the amino acid sequence of a nitrile hydratase is modified; a gene DNA encoding the above protein; a recombinant vector having the above gene DNA; a transformant or transductant having the above recombinant vector; a nitrile hydratase collected from a culture of the above transformant or transductant, and a production method thereof; and a method for producing an amide compound.

Abstract: The present invention relates to an amide hydrolase which is with excellent thermostability and stereoselectively hydrolyzes an ?-amino acid amide; a gene encoding the enzyme protein; a novel recombinant vector containing the gene; a transformant containing the recombinant vector; and a process for producing an L-?-amino acid using the transformant.

Abstract: A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.

Abstract: A method for producing lactones, which comprises reacting an amide compound of Formula (I): [wherein X represents a halogen atom; R, R? and R1 to R6 each independently represents a hydrogen atom or any desired substituent; and n represents an integer of 0 to 2] with an aqueous medium.

Abstract: The present invention provides: a protein having an improved nitrile hydratase activity, whereby heat resistance has been improved when compared with a wild-type nitrile hydratase activity, wherein the amino acid sequence of a nitrile hydratase is modified; a gene DNA encoding the above protein; a recombinant vector having the above gene DNA; a transformant or transductant having the above recombinant vector; a nitrile hydratase collected from a culture of the above transformant or transductant, and a production method thereof; and a method for producing an amide compound.