Abstract: A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.

Abstract: A copper sulfate plating bath is used which contains

Abstract: A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.

Abstract: There are provided a band-shaped tray 12 having grasping grooves 12a for grasping opposite side ends of wafers 1, and a cleaning tank 20 to which the wafers 1 inserted in the tray 12 are conveyed by a conveyor robot 2 to be cleaned. The cleaning tank 20 is provided with guides 22 for mounting the tray 12 in the tank, a bottom portion 26 formed substantially in V-shape conforming to the bottom-face shape of the wafer 1, and flow ports 24 via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank 20 is provided with an overflow tank 30 for containing the cleaning fluid overflowing from the cleaning tank 20, and the overflow tank 30 is provided with a circulation line 32 for circulating the cleaning fluid again into the cleaning tank 20.

Abstract: A plating apparatus and plating method for an electronic component substrate or the like which prevent the spread of metal contamination in and out of the plating apparatus, do not dissolve a seed layer, have no defects caused by scattering of a treating liquid and wash only the perimeter of the electronic component substrate or the like are provided. The plating apparatus is a plating apparatus for plating an object to be plated such as an electronic component substrate. The plating apparatus includes appropriate numbers of plating baths and baths used for washing or other purposes therein and carries out plating, edge etching, washing and drying continuously therein.

Abstract: A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank 10 for holding workpieces is provided, a supply line 14 for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve 12 for adjusting the flow of the cleaning solution is disposed in the middle of the supply line 14. The valve 12 is equipped with a switching section 12a for controlling the outflow of the cleaning solution by opening or closing the supply line 14, and a bypass 12b for supplying the cleaning solution, bypassing the switching section 12a.

Abstract: There are provided a wafer cleaning device which prevents the contamination of wafers and which can effectively clean the wafers and a tray for use in the wafer cleaning device.

Abstract: There are provided a wafer cleaning device which prevents the contamination of wafers and which can effectively clean the wafers and a tray for use in the wafer cleaning device.