Patents by Inventor Tetsuji Saikusa

Tetsuji Saikusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230168040
    Abstract: A heat exchanger includes: a heat exchange body having a plurality of flat tubes arranged and spaced from each other in a horizontal direction; an upper header provided at an upper end of the heat exchange body; a lower header provided at a lower end of the heat exchange body; and a partition plate provided in at least one of the upper and lower headers to partition the heat exchange body into a plurality of regions in a horizontal direction. The partition plate is provided such that in each of the regions, refrigerant flows in the opposite direction to the flow direction of the refrigerant in an adjacent one of the regions, and is provided such that regarding the regions, the more downward the region in the flow of the refrigerant when the heat exchanger operates as a condenser, the smaller a flow passage cross-sectional area of the region.
    Type: Application
    Filed: May 22, 2020
    Publication date: June 1, 2023
    Inventors: Yoji ONAKA, Takashi MATSUMOTO, Rihito ADACHI, Tetsuji SAIKUSA, Yuki NAKAO, Hiroyuki MORIMOTO
  • Publication number: 20230146747
    Abstract: A refrigerant distributor includes an outer pipe, an inner pipe, and a structural part. The refrigerant outflow hole is provided such that an angle ? between a lower end of the inner pipe on a vertical line passing through a center of the inner pipe and a position of presence of the refrigerant outflow hole as seen from the center of the inner pipe falls within a range of 10 degrees???80 degrees. The refrigerant outflow hole comprises a sole refrigerant outflow hole provided in a vertical cross-section of the inner pipe at a position where the refrigerant outflow hole is provided.
    Type: Application
    Filed: May 19, 2021
    Publication date: May 11, 2023
    Inventors: Yoji ONAKA, Takashi MATSUMOTO, Rihito ADACHI, Tetsuji SAIKUSA, Yuki NAKAO, Hiroyuki MORIMOTO, Atsushi KIBE
  • Publication number: 20230147134
    Abstract: A heat exchanger satisfies Expression (1) below, where the number of the main heat transfer tubes is represented as N1, and the number of the sub-heat transfer tubes is represented as N2. In this heat exchanger, the main heat exchanger satisfies Expressions (2) and (3) below, while the sub-heat exchanger satisfies Expressions (4) and (5) below. 0.1<N2(N1+N2)<0.4??(1) 0.03<Ta1/Ha1<0.3??(2) 0.03<Ta2/Ha2<0.
    Type: Application
    Filed: May 22, 2020
    Publication date: May 11, 2023
    Inventors: Yuki NAKAO, Tetsuji SAIKUSA, Rihito ADACHI
  • Publication number: 20230128871
    Abstract: A heat exchanger according to the present disclosure includes a main heat exchange unit configured to exchange heat between air and refrigerant, and condense the refrigerant, a subcooling heat exchange unit configured to exchange heat between air and the refrigerant passing through the main heat exchange unit, and subcool the refrigerant passing through the main heat exchange unit, and a connection pipe configured to connect the main heat exchange unit and the subcooling heat exchange unit to allow the refrigerant to pass therethrough, wherein the connection pipe connects the main heat exchange unit on its outflow side to the refrigerant and the subcooling heat exchange unit on its inflow side to the refrigerant, such that when the main heat exchange unit condenses the refrigerant, the refrigerant from the outside flows into the downstream side of the main heat exchange unit and the subcooling heat exchange unit relative to a flow of the air, and flows out from the upstream side of the main heat exchange unit
    Type: Application
    Filed: May 22, 2020
    Publication date: April 27, 2023
    Inventors: Tetsuji SAIKUSA, Nanami KISHIDA
  • Publication number: 20230101157
    Abstract: A heat exchanger includes a plurality of flat tubes in which refrigerant flows and a plurality of fins provided between the plurality of flat tubes and configured to transfer heat of refrigerant flowing in the plurality of flat tubes. An upstream end portion of each of the plurality of flat tubes in an air flow direction is located at the same position as an upstream end portion of each of the plurality of fins or protrudes farther than the upstream end portion of each of the plurality of fins, and an opening port is formed at the upstream end portion of each of the plurality of flat tubes or at the upstream end portion of each of the plurality of fins.
    Type: Application
    Filed: May 22, 2020
    Publication date: March 30, 2023
    Inventors: Rihito ADACHI, Yoji ONAKA, Tetsuji SAIKUSA
  • Publication number: 20230095279
    Abstract: A heat exchanger includes: a plurality of flat tubes each of which has a refrigerant flow passage through which refrigerant flows in an up-down direction, the plurality of flat tubes being arranged parallel to each other at intervals; a plurality of fins each of which is provided between adjacent flat tubes of the plurality of flat tubes; an upper header to which an upper end portion of each of the plurality of flat tubes is connected; and a lower header to which an a lower end portion of each of the plurality of flat tubes is connected. Lower end portions of the plurality of fins are not joined to the lower header, and a lower gap is formed between the lower end portions of the plurality of fins and the lower header.
    Type: Application
    Filed: May 22, 2020
    Publication date: March 30, 2023
    Inventors: Naoto HARA, Tetsuji SAIKUSA
  • Patent number: 10697677
    Abstract: A plate heat exchanger includes a plate stack including a plurality of heat transfer plates stacked with each other. Each of the heat transfer plates includes a heat medium inflow hole serving as an inlet for a heat medium, a heat medium outflow hole serving as an outlet for the heat medium, a refrigerant inflow hole serving as an inlet for refrigerant, and a refrigerant outflow portion located below the refrigerant inflow hole and serving as an outlet for the refrigerant. The heat transfer plates define heat medium passages, through each of which the heat medium flowing from the heat medium inflow hole flows, and refrigerant passages, through each of which the refrigerant flowing from the refrigerant inflow hole flows downward, arranged alternately with one another. Each of the heat medium passages and the refrigerant passages is defined between adjacent ones of the heat transfer plates.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 30, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoru Yanachi, Yohei Kato, Shinichi Uchino, Kohei Kasai, Tomoyoshi Obayashi, Kimitaka Kadowaki, Tetsuji Saikusa
  • Patent number: 10508848
    Abstract: A refrigeration cycle apparatus using refrigerant including HFO-1123, the refrigeration cycle apparatus including a compressor, a condenser, an expansion valve, and an evaporator connected in a loop, and a cooling unit configured to cool the refrigerant at an inlet of the expansion valve.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 17, 2019
    Assignees: Mitsubishi Electric Corporation, AGC INC.
    Inventors: Tetsuji Saikusa, Takeshi Sugimoto
  • Publication number: 20190170412
    Abstract: A plate heat exchanger includes a plate stack including a plurality of heat transfer plates stacked with each other. Each of the heat transfer plates includes a heat medium inflow hole serving as an inlet for a heat medium, a heat medium outflow hole serving as an outlet for the heat medium, a refrigerant inflow hole serving as an inlet for refrigerant, and a refrigerant outflow portion located below the refrigerant inflow hole and serving as an outlet for the refrigerant. The heat transfer plates define heat medium passages, through each of which the heat medium flowing from the heat medium inflow hole flows, and refrigerant passages, through each of which the refrigerant flowing from the refrigerant inflow hole flows downward, arranged alternately with one another. Each of the heat medium passages and the refrigerant passages is defined between adjacent ones of the heat transfer plates.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 6, 2019
    Inventors: Satoru YANACHI, Yohei KATO, Shinichi UCHINO, Kohei KASAI, Tomoyoshi OBAYASHI, Kimitaka KADOWAKI, Tetsuji SAIKUSA
  • Patent number: 10145598
    Abstract: A refrigeration apparatus includes a refrigerant circuit in which a compressor, a condenser, a liquid receiver, a first opening-and-closing valve, an expansion valve, and an evaporator are connected sequentially by pipes and through which refrigerant circulates. The refrigerant is HFO1123 or a refrigerant mixture containing HFO1123. A ratio of a refrigeration capacity to an opening area of the first opening-and-closing valve is within a range of 0.25 to 0.6 (kW/mm2).
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 4, 2018
    Assignees: Mitsubishi Electric Corporation, Asahi Glass Company, Limited
    Inventors: Takeshi Sugimoto, Tetsuji Saikusa
  • Publication number: 20160327321
    Abstract: A refrigeration apparatus includes a refrigerant circuit in which a compressor, a condenser, a liquid receiver, a first opening-and-closing valve, an expansion valve, and an evaporator are connected sequentially by pipes and through which refrigerant circulates. The refrigerant is HFO1123 or a refrigerant mixture containing HFO1123. A ratio of a refrigeration capacity to an opening area of the first opening-and-closing valve is within a range of 0.25 to 0.6 (kw/mm2).
    Type: Application
    Filed: March 14, 2014
    Publication date: November 10, 2016
    Inventors: Takeshi SUGIMOTO, Tetsuji SAIKUSA
  • Publication number: 20160320111
    Abstract: A refrigeration cycle apparatus using refrigerant including HFO-1123, the refrigeration cycle apparatus including a compressor, a condenser, an expansion valve, and an evaporator connected in a loop, and a cooling unit configured to cool the refrigerant at an inlet of the expansion valve.
    Type: Application
    Filed: March 14, 2014
    Publication date: November 3, 2016
    Inventors: Tetsuji SAIKUSA, Takeshi SUGIMOTO
  • Patent number: 8899058
    Abstract: Heating equipment, including a first heat exchanger, a compressor, a second heat exchanger, and a first expansion valve that decompresses a refrigerant flowing from the second heat exchanger to the first heat exchanger, are connected so as to circulate the refrigerant. A third heat exchanger provides heat of the refrigerant flowing from the second heat exchanger to the first heat exchanger to the refrigerant flowing from the first heat exchanger toward the compressor. An injection circuit merges part of the refrigerant flowing from the second heat exchanger to the first heat exchanger with the refrigerant that is sucked by the compressor. An injection expansion valve is installed in the injection circuit and decompresses the refrigerant flowing in the injection circuit. A fourth heat exchanger is installed in the injection circuit to supply heat of the refrigerant flowing from the second heat exchanger toward the first heat exchanger to the refrigerant flowing in the injection circuit.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: December 2, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Fumitake Unezaki, Makoto Saitou, Tetsuji Saikusa, Masanori Aoki, Masato Yosomiya
  • Patent number: 8109105
    Abstract: In a refrigerating air conditioning system using refrigerant such as CO2 used in a supercritical area, a highly efficient refrigerating air conditioning system is provided by adjusting the amount of refrigerant in a radiator which contributes to the efficiency of the system stably and quickly. During heat utilizing operation, the superheat at the exit of an evaporator is controlled to a predetermined value by controlling the opening of an expansion valve provided on the upstream side of the evaporator, and an expansion valve is controlled so that the state of refrigerant in a connection pipe on the high-pressure side becomes a supercritical state. In this state, a flow rate control valve is controlled to change the density of the refrigerant stored in a refrigerant storage container and the amount of refrigerant existing in the radiator is adjusted.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: February 7, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Fumitake Unezaki, Tetsuji Saikusa, Takashi Okazaki, Makoto Saitou, Hirokuni Shiba, Sou Nomoto
  • Publication number: 20110079040
    Abstract: A compressor 1 for compressing a refrigerant containing a hydrofluoroolefin refrigerant, a condenser 2 for condensing the refrigerant by heat exchange, a throttle device 4 for decompressing the condensed refrigerant, an evaporator 5 for evaporating the refrigerant by heat exchange between the decompressed refrigerant and air, and air adsorbing means 3 for adsorbing oxygen and nitrogen are connected by piping so as to configure a refrigerant circuit through which the refrigerant containing the hydrofluoroolefin refrigerant is circulated.
    Type: Application
    Filed: June 12, 2009
    Publication date: April 7, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki Morimoto, Kazuki Okada, Tetsuji Saikusa
  • Publication number: 20100192607
    Abstract: Heating equipment, including a first heat exchanger, a compressor, a second heat exchanger, and a first expansion valve that decompresses a refrigerant flowing from the second heat exchanger to the first heat exchanger, are connected so as to circulate the refrigerant. A third heat exchanger provides heat of the refrigerant flowing from the second heat exchanger to the first heat exchanger to the refrigerant flowing from the first heat exchanger toward the compressor. An injection circuit merges part of the refrigerant flowing from the second heat exchanger to the first heat exchanger with the refrigerant that is sucked by the compressor. An injection expansion valve is installed in the injection circuit and decompresses the refrigerant flowing in the injection circuit. A fourth heat exchanger is installed in the injection circuit to supply heat of the refrigerant flowing from the second heat exchanger toward the first heat exchanger to the refrigerant flowing in the injection circuit.
    Type: Application
    Filed: April 14, 2010
    Publication date: August 5, 2010
    Applicant: Mitsubishi Electric Corporation
    Inventors: Fumitake UNEZAKI, Makoto Saitou, Tetsuji Saikusa, Masanori Aoki, Masato Yosomiya
  • Publication number: 20090071177
    Abstract: A sufficient heating capacity can be displayed even in cold districts with atmospheric temperatures of ?10° C. or less by improving the heating capacity in the refrigerant air conditioner much more than that of conventional gas injection cycles.
    Type: Application
    Filed: March 27, 2006
    Publication date: March 19, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Fumitake Unezaki, Makoto Saitou, Tetsuji Saikusa, Masanori Aoki, Masato Yosomiya
  • Publication number: 20090013700
    Abstract: In a refrigerating air conditioning system using refrigerant such as CO2 used in a supercritical area, a highly efficient refrigerating air conditioning system is provided by adjusting the amount of refrigerant in a radiator which contributes to the efficiency of the system stably and quickly. During heat utilizing operation, the superheat at the exit of an evaporator is controlled to a predetermined value by controlling the opening of an expansion valve provided on the upstream side of the evaporator, and an expansion valve is controlled so that the state of refrigerant in a connection pipe on the high-pressure side becomes a supercritical state. In this state, a flow rate control valve is controlled to change the density of the refrigerant stored in a refrigerant storage container and the amount of refrigerant existing in the radiator is adjusted.
    Type: Application
    Filed: October 7, 2005
    Publication date: January 15, 2009
    Inventors: Fumitake Unezaki, Tetsuji Saikusa, Takashi Okazaki, Makoto Saitou, Hirokuni Shiba, Sou Nomoto
  • Patent number: RE43805
    Abstract: Refrigeration/air conditioning equipment includes a first internal heat exchanger for exchanging heat between a refrigerant to be sucked in a compressor and a high-pressure liquid refrigerant, an injection circuit for evaporating a bypassed high-pressure liquid at intermediate pressure and injecting the vaporized refrigerant into the compressor, a second internal heat exchanger for exchanging heat between the high-pressure liquid refrigerant and the refrigerant to be injected, and a heat source for heating the refrigerant to be injected.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: November 20, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masanori Aoki, Masato Yosomiya, Fumitake Unezaki, Makoto Saitou, Tetsuji Saikusa
  • Patent number: RE43998
    Abstract: Refrigeration/air conditioning equipment includes a first internal heat exchanger for exchanging heat between a refrigerant to be sucked in a compressor and a high-pressure liquid refrigerant, an injection circuit for evaporating a bypassed high-pressure liquid at intermediate pressure and injecting the vaporized refrigerant into the compressor, a second internal heat exchanger for exchanging heat between the high-pressure liquid refrigerant and the refrigerant to be injected, and a heat source for heating the refrigerant to be injected.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: February 19, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masanori Aoki, Masato Yosomiya, Fumitake Unezaki, Makoto Saitou, Tetsuji Saikusa