Patents by Inventor Tetsuji SEINO

Tetsuji SEINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10967588
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 6, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Publication number: 20200147908
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
  • Patent number: 10569487
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: February 25, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Patent number: 10391727
    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 27, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Publication number: 20190248083
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
  • Publication number: 20180215113
    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.
    Type: Application
    Filed: March 20, 2018
    Publication date: August 2, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
  • Patent number: 9956731
    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: May 1, 2018
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Publication number: 20160265741
    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.
    Type: Application
    Filed: March 11, 2016
    Publication date: September 15, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA