Patents by Inventor Tetsuji Shiozawa

Tetsuji Shiozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8881633
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: November 11, 2014
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Patent number: 8707842
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: April 29, 2014
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Publication number: 20110138986
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Publication number: 20080022834
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Application
    Filed: July 15, 2005
    Publication date: January 31, 2008
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama