Abstract: A dielectric block plating apparatus provides electrolytic solution to be circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined areas of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.

Abstract: In a dielectric block plating process an electrolytic solution is circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined arears of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.